AMD Xilinx
XC6SLX100-L1FGG676C
XC6SLX100-L1FGG676C ECAD Model
XC6SLX100-L1FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 101261 | |
| Number of CLBs | 7911 | |
| Combinatorial Delay of a CLB-Max | 460 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7911 CLBS | |
| Power Supplies | 1,2.5/3.3 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6SLX100-L1FGG676C Datasheet Download
XC6SLX100-L1FGG676C Overview
The XC6SLX100-L1FGG676C chip model is a cutting-edge technology that is gaining traction in the industry. It is a powerful, low-power, low-cost, and reliable solution for many applications. The chip model is designed for a wide range of applications, including embedded systems, medical, automotive, industrial, and consumer electronics. Its features include a dual-core processor, high-speed memory, and a wide range of peripheral interfaces.
In the future, the demand for the XC6SLX100-L1FGG676C chip model is expected to increase in the related industries. The chip model can provide the necessary performance, power efficiency, and cost savings compared to other solutions. As the demand for advanced technology increases, the XC6SLX100-L1FGG676C chip model is likely to become a more popular choice.
The XC6SLX100-L1FGG676C chip model can be used in the development and popularization of future intelligent robots. It is capable of providing the necessary performance and power efficiency for robotics applications. With the increasing popularity of robotics, the chip model is likely to be a preferred choice for many robotics projects.
In order to use the XC6SLX100-L1FGG676C chip model effectively, certain technical talents are required. These include knowledge of embedded systems, programming, and robotics. The chip model is also compatible with many development tools, such as the Xilinx Vivado Design Suite, which can be used to develop and debug applications.
The XC6SLX100-L1FGG676C chip model is a powerful solution for many applications. It is expected to become increasingly popular in the related industries in the future. With the right technical talents and development tools, the chip model can be used to develop and popularize future intelligent robots.
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1,499 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $113.1624 | $113.1624 |
| 10+ | $111.9456 | $1,119.4560 |
| 100+ | $105.8616 | $10,586.1600 |
| 1000+ | $99.7776 | $49,888.8000 |
| 10000+ | $91.2600 | $91,260.0000 |
| The price is for reference only, please refer to the actual quotation! | ||