XC6SLX100-3FGG676I
XC6SLX100-3FGG676I
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AMD Xilinx

XC6SLX100-3FGG676I


XC6SLX100-3FGG676I
F20-XC6SLX100-3FGG676I
Active
BGA676

XC6SLX100-3FGG676I ECAD Model


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XC6SLX100-3FGG676I Attributes


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XC6SLX100-3FGG676I Overview



The Xilinx XC6SLX100-3FGG676I is a revolutionary chip model that has been designed to meet the needs of modern industries. It is a field programmable gate array (FPGA) designed with a Spartan-6 LX100-3FGG676I core. This chip model is ideal for a wide range of applications such as embedded systems, digital signal processing, and video processing.


The XC6SLX100-3FGG676I is a powerful and versatile chip model that offers many advantages. It has a 3.3V I/O voltage, a maximum operating frequency of up to 400MHz, and a power consumption of less than 2W. The chip model also comes with a rich set of features, including a large amount of logic elements, a wide range of I/O pins, and support for several high-speed transceivers. Furthermore, the chip model has a small form factor and is compatible with a wide range of development tools, making it easy to use and deploy.


The XC6SLX100-3FGG676I is expected to be in high demand in the near future. The chip model is ideal for a wide range of applications, including automotive, industrial, medical, and consumer electronics. The chip model can also be used in a variety of other applications, such as military, aerospace, and communications. As the demand for more sophisticated technologies increases, the XC6SLX100-3FGG676I is expected to be in even higher demand.


The XC6SLX100-3FGG676I is a powerful and versatile chip model that can be used in a variety of applications. It is important to understand the product description and specific design requirements of the chip model in order to ensure that the chip model is used effectively and efficiently. It is also important to consider the application environment and the new technologies required to support the chip model.


In addition, there are a few precautions to keep in mind when using the XC6SLX100-3FGG676I. The chip model is sensitive to electrostatic discharge, and it is important to use appropriate grounding techniques to protect the chip model from damage. Additionally, the chip model is sensitive to temperature, and it is important to keep the chip model within the specified temperature range to ensure proper operation.


To sum up, the XC6SLX100-3FGG676I is a powerful and versatile chip model that can be used in a variety of applications. It is important to understand the product description and specific design requirements of the chip model in order to ensure that the chip model is used effectively and efficiently. It is also important to consider the application environment and the new technologies required to support the chip model. Additionally, it is important to keep in mind the precautions associated with the chip model, such as electrostatic discharge and temperature sensitivity. With the right knowledge and understanding, the XC6SLX100-3FGG676I can be used to its full potential in a variety of industries.



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