XC6SLX100-3FGG676C

The XC6SLX100-3FGG676C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range FPGA with 6,000 logic cells and a maximum operating frequency of 250 MHz. It has a total of 100,000 logic elements and includes 384 I/O pins. It is a 6-layer board with a total power dissipation of 8.5 watts and a maximum junction temperature of 85°C.

The XC6SLX100-3FGG676C is designed for use in a variety of applications, including embedded systems, communications, and industrial automation. It has a wide range of features and capabilities, including high-speed transceivers, memory controllers, and a variety of digital signal processing (DSP) blocks. It also supports multiple clock domains and can be used to implement a variety of protocols, such as Ethernet, PCI Express, USB, and SATA.

The XC6SLX100-3FGG676C is a highly versatile chip, and can be used in a wide range of applications. It is ideal for applications that require high-performance, low-power operation, such as medical imaging, automotive, and industrial automation. It can also be used for applications that require high-speed data transfer, such as video streaming and wireless communications. Additionally, it can be used for applications that require high-accuracy and low-latency, such as financial trading systems.