XC6SLX100-2FGG676I

The XC6SLX100-2FGG676I is an FPGA chip model manufactured by Xilinx. It is a low-cost, high-performance device that provides an easy-to-use solution for a variety of applications.

The XC6SLX100-2FGG676I features a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, and has a total of 100K logic cells. It is designed to provide maximum system integration, with a wide range of features for embedded design. It has two clock management tiles, four dedicated DSP slices, four configurable I/O blocks, and two high-speed transceivers.

The XC6SLX100-2FGG676I can be used in a variety of applications including industrial automation, medical imaging, video processing, and communications. It supports a variety of high-speed transceivers such as LVDS, SGMII, and XAUI, as well as high-speed clock management functions. It also supports a wide range of I/O standards such as LVTTL, LVCMOS, and HSTL.

The XC6SLX100-2FGG676I is a powerful and versatile chip that can be used in a variety of applications. Its features make it an ideal choice for embedded design and system integration. It is a cost-effective solution that can help reduce time to market and increase system performance.