AMD Xilinx
XC5VTX150T-2FF1759C
XC5VTX150T-2FF1759C ECAD Model
XC5VTX150T-2FF1759C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 680 | |
| Number of Outputs | 680 | |
| Number of Logic Cells | 148480 | |
| Number of CLBs | 11600 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11600 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | BGA-1759 | |
| Pin Count | 1759 | |
| ECCN Code | 3A001.A.7.A |
XC5VTX150T-2FF1759C Datasheet Download
XC5VTX150T-2FF1759C Overview
The XC5VTX150T-2FF1759C chip model is a powerful and versatile device that has been designed for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is based on a high-performance field-programmable gate array (FPGA) architecture and requires the use of HDL language for programming.
The XC5VTX150T-2FF1759C chip model is designed to provide flexibility and scalability in order to meet the needs of diverse applications. It is capable of handling multiple tasks simultaneously and can be easily upgraded to meet future demands. Furthermore, it is suitable for advanced communication systems, as it is capable of handling high-speed data transmission with minimal latency.
The XC5VTX150T-2FF1759C chip model is designed to provide the best possible performance and reliability. It has a wide range of features, including high-speed data transfer, low-power operation, and advanced error-correction capabilities. Additionally, it has a robust set of development tools that make it easy to create customized designs.
When designing with the XC5VTX150T-2FF1759C chip model, it is important to consider the specific requirements of the application in order to ensure the best possible performance. Additionally, it is important to consider the potential future upgrades that may be necessary. Furthermore, it is important to be aware of the potential risks associated with using this type of device, such as power failure or data corruption.
In order to ensure the best possible performance, it is important to use the XC5VTX150T-2FF1759C chip model correctly. There are several case studies available which provide detailed information about the design process and any potential issues that may arise. Additionally, it is important to take the necessary precautions in order to ensure the safety and reliability of the device.
In conclusion, the XC5VTX150T-2FF1759C chip model is a powerful and versatile device that is suitable for a wide range of applications. It is capable of handling multiple tasks simultaneously and can be easily upgraded for future demands. Additionally, it has a robust set of development tools and is suitable for advanced communication systems. However, it is important to consider the specific requirements of the application and be aware of the potential risks associated with using this type of device.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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