
AMD Xilinx
XC5VSX50T-3FF665C
XC5VSX50T-3FF665C ECAD Model
XC5VSX50T-3FF665C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 52224 | |
Number of CLBs | 4080 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4080 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B665 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 665 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA665,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.9 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-665 | |
Pin Count | 665 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC5VSX50T-3FF665C Datasheet Download
XC5VSX50T-3FF665C Overview
The chip model XC5VSX50T-3FF665C is a revolutionary piece of technology that has revolutionized the chip industry. Developed by Xilinx, Inc., this chip model is designed to provide advanced communication systems with a high-performance, low-power solution. It is a powerful and versatile chip that can be used in a variety of applications and is suitable for any environment.
The XC5VSX50T-3FF665C chip model is based on the Virtex-5 FPGA family and is built on the 65nm process technology. It features a total of five dedicated hard blocks, including two PowerPC 440 cores, two RocketIO transceivers, and a high-performance DSP block. The chip also features an advanced memory system, with support for DDR2, DDR3, QDRII, and RLDRAM II memory. Additionally, the chip model also features a variety of I/O and clocking options, making it suitable for a wide range of applications.
In terms of industry trends, the XC5VSX50T-3FF665C chip model is a great choice for those looking to stay ahead of the curve. The chip model provides a high-performance and low-power solution that can be used in a variety of applications. Additionally, the chip model is designed to be upgradable, allowing users to take advantage of new technologies as they become available. This makes the XC5VSX50T-3FF665C an ideal choice for those looking to stay ahead of the competition.
In terms of product description, the XC5VSX50T-3FF665C chip model is designed to provide a high-performance and low-power solution for advanced communication systems. It features five dedicated hard blocks, including two PowerPC 440 cores, two RocketIO transceivers, and a high-performance DSP block. Additionally, the chip model also features an advanced memory system, with support for DDR2, DDR3, QDRII, and RLDRAM II memory. Furthermore, the chip model also features a variety of I/O and clocking options, making it suitable for a wide range of applications.
When it comes to actual case studies, the XC5VSX50T-3FF665C chip model has been used in a variety of applications. For example, it has been used in the development of high-speed wireless communication systems and next-generation automotive control systems. Additionally, the chip model has also been used in the development of high-performance computing systems, as well as in the development of advanced image processing systems.
Finally, when it comes to precautions, it is important to note that the XC5VSX50T-3FF665C chip model is designed to be upgradable, allowing users to take advantage of new technologies as they become available. However, it is important to note that the chip model is not designed to be a one-size-fits-all solution. Therefore, it is important to ensure that the specific technologies needed for the application environment are supported by the chip model before making a purchase.
Overall, the XC5VSX50T-3FF665C chip model is a powerful and versatile piece of technology that can be used in a variety of applications. It is designed to provide a high-performance and low-power solution for advanced communication systems, and it is also upgradable, allowing users to take advantage of new technologies as they become available. However, it is important to ensure that the specific technologies needed for the application environment are supported by the chip model before making a purchase.
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2,342 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,474.9800 | $1,474.9800 |
10+ | $1,459.1200 | $14,591.2000 |
100+ | $1,379.8200 | $137,982.0000 |
1000+ | $1,300.5200 | $650,260.0000 |
10000+ | $1,189.5000 | $1,189,500.0000 |
The price is for reference only, please refer to the actual quotation! |