XC5VSX50T-3FF665C
XC5VSX50T-3FF665C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC5VSX50T-3FF665C


XC5VSX50T-3FF665C
F20-XC5VSX50T-3FF665C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-665
BGA-665

XC5VSX50T-3FF665C ECAD Model


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XC5VSX50T-3FF665C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 360
Number of Outputs 360
Number of Logic Cells 52224
Number of CLBs 4080
Combinatorial Delay of a CLB-Max 670 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 4080 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B665
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 665
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA665,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.9 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-665
Pin Count 665
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC5VSX50T-3FF665C Datasheet Download


XC5VSX50T-3FF665C Overview



The chip model XC5VSX50T-3FF665C is a revolutionary piece of technology that has revolutionized the chip industry. Developed by Xilinx, Inc., this chip model is designed to provide advanced communication systems with a high-performance, low-power solution. It is a powerful and versatile chip that can be used in a variety of applications and is suitable for any environment.


The XC5VSX50T-3FF665C chip model is based on the Virtex-5 FPGA family and is built on the 65nm process technology. It features a total of five dedicated hard blocks, including two PowerPC 440 cores, two RocketIO transceivers, and a high-performance DSP block. The chip also features an advanced memory system, with support for DDR2, DDR3, QDRII, and RLDRAM II memory. Additionally, the chip model also features a variety of I/O and clocking options, making it suitable for a wide range of applications.


In terms of industry trends, the XC5VSX50T-3FF665C chip model is a great choice for those looking to stay ahead of the curve. The chip model provides a high-performance and low-power solution that can be used in a variety of applications. Additionally, the chip model is designed to be upgradable, allowing users to take advantage of new technologies as they become available. This makes the XC5VSX50T-3FF665C an ideal choice for those looking to stay ahead of the competition.


In terms of product description, the XC5VSX50T-3FF665C chip model is designed to provide a high-performance and low-power solution for advanced communication systems. It features five dedicated hard blocks, including two PowerPC 440 cores, two RocketIO transceivers, and a high-performance DSP block. Additionally, the chip model also features an advanced memory system, with support for DDR2, DDR3, QDRII, and RLDRAM II memory. Furthermore, the chip model also features a variety of I/O and clocking options, making it suitable for a wide range of applications.


When it comes to actual case studies, the XC5VSX50T-3FF665C chip model has been used in a variety of applications. For example, it has been used in the development of high-speed wireless communication systems and next-generation automotive control systems. Additionally, the chip model has also been used in the development of high-performance computing systems, as well as in the development of advanced image processing systems.


Finally, when it comes to precautions, it is important to note that the XC5VSX50T-3FF665C chip model is designed to be upgradable, allowing users to take advantage of new technologies as they become available. However, it is important to note that the chip model is not designed to be a one-size-fits-all solution. Therefore, it is important to ensure that the specific technologies needed for the application environment are supported by the chip model before making a purchase.


Overall, the XC5VSX50T-3FF665C chip model is a powerful and versatile piece of technology that can be used in a variety of applications. It is designed to provide a high-performance and low-power solution for advanced communication systems, and it is also upgradable, allowing users to take advantage of new technologies as they become available. However, it is important to ensure that the specific technologies needed for the application environment are supported by the chip model before making a purchase.



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Unit Price: $1,586.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,474.9800 $1,474.9800
10+ $1,459.1200 $14,591.2000
100+ $1,379.8200 $137,982.0000
1000+ $1,300.5200 $650,260.0000
10000+ $1,189.5000 $1,189,500.0000
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