AMD Xilinx
XC5VSX35T-3FF665C
XC5VSX35T-3FF665C ECAD Model
XC5VSX35T-3FF665C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 34816 | |
| Number of CLBs | 2720 | |
| Combinatorial Delay of a CLB-Max | 670 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2720 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B665 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 665 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA665,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-665 | |
| Pin Count | 665 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC5VSX35T-3FF665C Datasheet Download
XC5VSX35T-3FF665C Overview
Xilinx's XC5VSX35T-3FF665C chip model is a powerful FPGA (Field Programmable Gate Array) device that has been designed to meet the needs of advanced communication systems. It is a high-performance device that has been designed to provide the flexibility and scalability necessary for complex applications.
The XC5VSX35T-3FF665C chip model is built on the Virtex-5 family of FPGAs and offers a wide range of features and capabilities. It provides a high level of integration and flexibility, allowing users to customize their designs to meet their specific needs. The device also includes a wide range of I/O options, including LVDS, SSTL, and HTX interfaces, as well as support for high-speed transceivers.
The XC5VSX35T-3FF665C chip model is designed to meet the needs of advanced communication systems. It is capable of handling high-speed data transfers, as well as providing the necessary flexibility to support complex applications. The device is also designed to be easily upgradable, allowing users to easily upgrade their designs to meet their changing needs.
In addition to its use in advanced communication systems, the XC5VSX35T-3FF665C chip model can also be used in the development and popularization of future intelligent robots. The device's flexibility and scalability make it an ideal platform for the development of sophisticated robotics applications. To effectively use the model, users will need to have experience in programming FPGAs and developing embedded systems.
In conclusion, the XC5VSX35T-3FF665C chip model is a powerful and flexible device that is designed to meet the needs of advanced communication systems. It is also capable of being used in the development and popularization of future intelligent robots. To effectively use the model, users will need to have experience in programming FPGAs and developing embedded systems.
You May Also Be Interested In
3,378 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $949.5263 | $949.5263 |
| 10+ | $939.3163 | $9,393.1632 |
| 100+ | $888.2665 | $88,826.6520 |
| 1000+ | $837.2167 | $418,608.3600 |
| 10000+ | $765.7470 | $765,747.0000 |
| The price is for reference only, please refer to the actual quotation! | ||