AMD Xilinx
XC5VSX35T-2FF665C
XC5VSX35T-2FF665C ECAD Model
XC5VSX35T-2FF665C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 34816 | |
| Number of CLBs | 2720 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2720 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B665 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 665 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA665,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-665 | |
| Pin Count | 665 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC5VSX35T-2FF665C Datasheet Download
XC5VSX35T-2FF665C Overview
The XC5VSX35T-2FF665C chip model is a high-performance model designed for digital signal processing, embedded processing, and image processing. It is a powerful and versatile tool that allows users to create complex applications with the help of HDL (Hardware Description Language).
The chip model has been widely used in the industry, and its application scenarios are constantly expanding. As technology advances, the XC5VSX35T-2FF665C chip model is expected to be applied to more industries in the future. For example, the chip model can be used in the development and popularization of future intelligent robots. This will require the use of new technologies and the support of skilled technical talent.
The chip model XC5VSX35T-2FF665C is a powerful tool for creating complex applications. It is capable of handling high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, and its application scenarios are constantly expanding. As technology advances, the chip model is expected to be applied to more industries in the future, such as the development and popularization of future intelligent robots. To use the chip model effectively, technical talent with knowledge of HDL language and other related technologies are needed. The future of the industry is bright and the chip model will continue to be a powerful tool for creating complex applications.
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4,532 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $554.2056 | $554.2056 |
| 10+ | $548.2464 | $5,482.4640 |
| 100+ | $518.4504 | $51,845.0400 |
| 1000+ | $488.6544 | $244,327.2000 |
| 10000+ | $446.9400 | $446,940.0000 |
| The price is for reference only, please refer to the actual quotation! | ||