
AMD Xilinx
XC5VLX50T-3FF1136C
XC5VLX50T-3FF1136C ECAD Model
XC5VLX50T-3FF1136C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 480 | |
Number of Outputs | 480 | |
Number of Logic Cells | 46080 | |
Number of CLBs | 3600 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 3600 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 10.5 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1136 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1136 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1136,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-1136 | |
Pin Count | 1136 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC5VLX50T-3FF1136C Datasheet Download
XC5VLX50T-3FF1136C Overview
The Xilinx Virtex 5 FPGA XC5VLX50T-3FF1136C chip model is a high-performance device designed to meet the needs of a wide range of applications. Its original design intention was to provide a powerful, flexible and cost-effective solution for advanced communication systems. The chip model is capable of delivering high-speed data processing and transmission, allowing for the integration of multiple applications into a single platform.
The XC5VLX50T-3FF1136C is built with a large number of configurable logic blocks, memory blocks and interconnects, making it suitable for a variety of applications. It is capable of handling high-speed data processing and transmission, which makes it suitable for a variety of network applications. The chip model also supports various intelligent scenarios, such as AI, machine learning, and deep learning.
The product description of the XC5VLX50T-3FF1136C chip model includes features such as a high-speed transceiver, a high-performance memory controller, an enhanced digital signal processing engine, and a high-speed communication interface. The chip model also supports multiple protocols, such as Ethernet, USB, and HDMI. In addition, the chip model has a low power consumption and is designed to be compatible with a wide range of development tools.
In terms of future upgrades, the XC5VLX50T-3FF1136C chip model can be upgraded to support more advanced features and technologies. For example, the chip model can be upgraded to support 5G networks, AI and machine learning applications, and high-speed data processing and transmission. It is also possible to use the chip model in the era of fully intelligent systems, as it is capable of handling complex tasks and data processing.
In order to ensure the successful implementation of the XC5VLX50T-3FF1136C chip model, there are certain design requirements that must be taken into consideration. For example, the chip model requires a high-speed transceiver and a high-performance memory controller. In addition, the chip model should be designed to meet the specific needs of the application. It is also important to consider the environmental factors when designing the chip model, as well as any potential risks associated with the design.
Case studies can be used to understand the performance of the XC5VLX50T-3FF1136C chip model. For example, a case study can be used to analyze the performance of the chip model in a real-world environment. It is also important to consider the potential risks associated with the chip model, such as power consumption, heat dissipation, and noise levels. Finally, it is important to consider the potential security risks associated with the chip model, as it is capable of handling sensitive data.
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1,709 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $986.5440 | $986.5440 |
10+ | $975.9360 | $9,759.3600 |
100+ | $922.8960 | $92,289.6000 |
1000+ | $869.8560 | $434,928.0000 |
10000+ | $795.6000 | $795,600.0000 |
The price is for reference only, please refer to the actual quotation! |