XC5VLX50T-3FF1136C
XC5VLX50T-3FF1136C
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rohs

AMD Xilinx

XC5VLX50T-3FF1136C


XC5VLX50T-3FF1136C
F20-XC5VLX50T-3FF1136C
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA-1136
BGA-1136

XC5VLX50T-3FF1136C ECAD Model


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XC5VLX50T-3FF1136C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 480
Number of Outputs 480
Number of Logic Cells 46080
Number of CLBs 3600
Combinatorial Delay of a CLB-Max 670 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 3600 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 10.5 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1136
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1136
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1136,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.25 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-1136
Pin Count 1136
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC5VLX50T-3FF1136C Datasheet Download


XC5VLX50T-3FF1136C Overview



The Xilinx Virtex 5 FPGA XC5VLX50T-3FF1136C chip model is a high-performance device designed to meet the needs of a wide range of applications. Its original design intention was to provide a powerful, flexible and cost-effective solution for advanced communication systems. The chip model is capable of delivering high-speed data processing and transmission, allowing for the integration of multiple applications into a single platform.


The XC5VLX50T-3FF1136C is built with a large number of configurable logic blocks, memory blocks and interconnects, making it suitable for a variety of applications. It is capable of handling high-speed data processing and transmission, which makes it suitable for a variety of network applications. The chip model also supports various intelligent scenarios, such as AI, machine learning, and deep learning.


The product description of the XC5VLX50T-3FF1136C chip model includes features such as a high-speed transceiver, a high-performance memory controller, an enhanced digital signal processing engine, and a high-speed communication interface. The chip model also supports multiple protocols, such as Ethernet, USB, and HDMI. In addition, the chip model has a low power consumption and is designed to be compatible with a wide range of development tools.


In terms of future upgrades, the XC5VLX50T-3FF1136C chip model can be upgraded to support more advanced features and technologies. For example, the chip model can be upgraded to support 5G networks, AI and machine learning applications, and high-speed data processing and transmission. It is also possible to use the chip model in the era of fully intelligent systems, as it is capable of handling complex tasks and data processing.


In order to ensure the successful implementation of the XC5VLX50T-3FF1136C chip model, there are certain design requirements that must be taken into consideration. For example, the chip model requires a high-speed transceiver and a high-performance memory controller. In addition, the chip model should be designed to meet the specific needs of the application. It is also important to consider the environmental factors when designing the chip model, as well as any potential risks associated with the design.


Case studies can be used to understand the performance of the XC5VLX50T-3FF1136C chip model. For example, a case study can be used to analyze the performance of the chip model in a real-world environment. It is also important to consider the potential risks associated with the chip model, such as power consumption, heat dissipation, and noise levels. Finally, it is important to consider the potential security risks associated with the chip model, as it is capable of handling sensitive data.



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Unit Price: $1,060.80
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $986.5440 $986.5440
10+ $975.9360 $9,759.3600
100+ $922.8960 $92,289.6000
1000+ $869.8560 $434,928.0000
10000+ $795.6000 $795,600.0000
The price is for reference only, please refer to the actual quotation!

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