XC5VLX50-3FFG324C
XC5VLX50-3FFG324C
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rohs

AMD Xilinx

XC5VLX50-3FFG324C


XC5VLX50-3FFG324C
F20-XC5VLX50-3FFG324C
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA-324
BGA-324

XC5VLX50-3FFG324C ECAD Model


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XC5VLX50-3FFG324C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 220
Number of Outputs 220
Number of Logic Cells 46080
Number of CLBs 3600
Combinatorial Delay of a CLB-Max 670 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 3600 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-324
Pin Count 324
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC5VLX50-3FFG324C Datasheet Download


XC5VLX50-3FFG324C Overview



The chip model XC5VLX50-3FFG324C is an important part of the modern technology industry, as it has a wide range of applications in various industries. As a cutting-edge technology, the XC5VLX50-3FFG324C chip model has the potential to revolutionize the way people interact with technology and how technology is used in everyday life.


The XC5VLX50-3FFG324C chip model is a Field Programmable Gate Array (FPGA) device that is designed to enable high-performance computing and data processing. It is capable of supporting a wide range of technologies and applications, making it an ideal choice for many industries. It is also designed to be highly scalable and can be upgraded to support new technologies as needed.


The original design intention of the XC5VLX50-3FFG324C chip model is to provide a powerful and versatile computing platform that can be used in a variety of different applications. It is capable of supporting the latest technologies and is suitable for use in advanced communication systems. The chip model is also capable of supporting the development and popularization of future intelligent robots, which requires the support of specialized technical talent to use the model effectively.


In terms of future industry trends, the XC5VLX50-3FFG324C chip model is expected to be used in a wide range of applications, including the Internet of Things (IoT) and Artificial Intelligence (AI). The chip model is also expected to be used in the development of autonomous vehicles, robotics, and smart home systems. As technology continues to advance, the chip model is expected to be upgraded to support new technologies and applications.


In conclusion, the XC5VLX50-3FFG324C chip model is an important part of the modern technology industry and is capable of supporting a wide range of applications. It is also capable of being upgraded to support new technologies as needed and is suitable for use in advanced communication systems and the development and popularization of future intelligent robots. As technology continues to advance, the XC5VLX50-3FFG324C chip model is expected to remain an important part of the industry and will continue to be used in a variety of different applications.



2,064 In Stock


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Unit Price: $1,156.56
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,075.6008 $1,075.6008
10+ $1,064.0352 $10,640.3520
100+ $1,006.2072 $100,620.7200
1000+ $948.3792 $474,189.6000
10000+ $867.4200 $867,420.0000
The price is for reference only, please refer to the actual quotation!

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