
AMD Xilinx
XC5VLX50-3FFG324C
XC5VLX50-3FFG324C ECAD Model
XC5VLX50-3FFG324C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 220 | |
Number of Outputs | 220 | |
Number of Logic Cells | 46080 | |
Number of CLBs | 3600 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 3600 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm | |
Length | 19 mm | |
Seated Height-Max | 2.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-324 | |
Pin Count | 324 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC5VLX50-3FFG324C Datasheet Download
XC5VLX50-3FFG324C Overview
The chip model XC5VLX50-3FFG324C is an important part of the modern technology industry, as it has a wide range of applications in various industries. As a cutting-edge technology, the XC5VLX50-3FFG324C chip model has the potential to revolutionize the way people interact with technology and how technology is used in everyday life.
The XC5VLX50-3FFG324C chip model is a Field Programmable Gate Array (FPGA) device that is designed to enable high-performance computing and data processing. It is capable of supporting a wide range of technologies and applications, making it an ideal choice for many industries. It is also designed to be highly scalable and can be upgraded to support new technologies as needed.
The original design intention of the XC5VLX50-3FFG324C chip model is to provide a powerful and versatile computing platform that can be used in a variety of different applications. It is capable of supporting the latest technologies and is suitable for use in advanced communication systems. The chip model is also capable of supporting the development and popularization of future intelligent robots, which requires the support of specialized technical talent to use the model effectively.
In terms of future industry trends, the XC5VLX50-3FFG324C chip model is expected to be used in a wide range of applications, including the Internet of Things (IoT) and Artificial Intelligence (AI). The chip model is also expected to be used in the development of autonomous vehicles, robotics, and smart home systems. As technology continues to advance, the chip model is expected to be upgraded to support new technologies and applications.
In conclusion, the XC5VLX50-3FFG324C chip model is an important part of the modern technology industry and is capable of supporting a wide range of applications. It is also capable of being upgraded to support new technologies as needed and is suitable for use in advanced communication systems and the development and popularization of future intelligent robots. As technology continues to advance, the XC5VLX50-3FFG324C chip model is expected to remain an important part of the industry and will continue to be used in a variety of different applications.
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2,064 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,075.6008 | $1,075.6008 |
10+ | $1,064.0352 | $10,640.3520 |
100+ | $1,006.2072 | $100,620.7200 |
1000+ | $948.3792 | $474,189.6000 |
10000+ | $867.4200 | $867,420.0000 |
The price is for reference only, please refer to the actual quotation! |