AMD Xilinx
XC5VLX50-3FFG1153I
XC5VLX50-3FFG1153I ECAD Model
XC5VLX50-3FFG1153I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 560 | |
| Number of Outputs | 560 | |
| Number of Logic Cells | 3600 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 710 MHz | |
| Power Supplies | 1,2.5 V | |
| JESD-30 Code | S-PBGA-B1153 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1153 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1153,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5VLX50-3FFG1153I Datasheet Download
XC5VLX50-3FFG1153I Overview
The chip model XC5VLX50-3FFG1153I is a high-performance and power-efficient FPGA from Xilinx. This chip model is designed to provide high-speed data processing, programmable logic, and multiple I/O capabilities for a wide range of applications. It is a low-cost, low-power, and reliable FPGA that can be used in a variety of applications.
The chip model XC5VLX50-3FFG1153I is designed to provide high-performance, power-efficient, and reliable solutions for various applications. It is suitable for use in a variety of industries, such as automotive, consumer electronics, industrial, medical, and aerospace. The chip model is also suitable for use in applications that require high-speed data processing, such as networking, artificial intelligence, and machine learning.
The industry trends of the chip model XC5VLX50-3FFG1153I are mainly focused on its performance, power efficiency, and reliability. This chip model is designed to provide high-performance solutions for various applications. It is also designed to be power-efficient and reliable, which makes it suitable for use in a variety of applications.
In terms of the future development of related industries, the chip model XC5VLX50-3FFG1153I is expected to be used in a variety of applications, such as networking, artificial intelligence, and machine learning. It is also expected to be used in the era of fully intelligent systems. In terms of the application environment, the chip model is expected to provide support for new technologies, such as 5G, AI, and IoT.
The product description and specific design requirements of the chip model XC5VLX50-3FFG1153I are mainly focused on the performance, power efficiency, and reliability of the chip. The chip model is designed to provide high-performance solutions for various applications. It is also designed to be power-efficient and reliable, which makes it suitable for use in a variety of applications.
In terms of actual case studies and precautions, the chip model XC5VLX50-3FFG1153I has been used in various applications, such as automotive, consumer electronics, industrial, medical, and aerospace. The chip model has been found to be reliable and power-efficient, and it has been able to provide high-performance solutions for various applications. However, when using this chip model, users should take into consideration the specific design requirements of the chip model and the application environment.
In conclusion, the chip model XC5VLX50-3FFG1153I is a high-performance and power-efficient FPGA from Xilinx. It is designed to provide high-performance, power-efficient, and reliable solutions for various applications. It is suitable for use in a variety of industries, such as automotive, consumer electronics, industrial, medical, and aerospace. In terms of the future development of related industries, the chip model is expected to be used in a variety of applications, such as networking, artificial intelligence, and machine learning. It is also expected to provide support for new technologies, such as 5G, AI, and IoT. When using this chip model, users should take into consideration the specific design requirements of the chip model and the application environment.
3,790 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,075.6008 | $1,075.6008 |
| 10+ | $1,064.0352 | $10,640.3520 |
| 100+ | $1,006.2072 | $100,620.7200 |
| 1000+ | $948.3792 | $474,189.6000 |
| 10000+ | $867.4200 | $867,420.0000 |
| The price is for reference only, please refer to the actual quotation! | ||