AMD Xilinx
XC5VLX50-3FF1153C
XC5VLX50-3FF1153C ECAD Model
XC5VLX50-3FF1153C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 560 | |
| Number of Outputs | 560 | |
| Number of Logic Cells | 46080 | |
| Number of CLBs | 3600 | |
| Combinatorial Delay of a CLB-Max | 670 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 3600 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1153 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1153 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1153,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-1153 | |
| Pin Count | 1153 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC5VLX50-3FF1153C Datasheet Download
XC5VLX50-3FF1153C Overview
The chip model XC5VLX50-3FF1153C is a powerful and versatile device that is designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. This chip model is designed to be used with the HDL language, which is a popular and powerful language for designing digital circuits.
The chip model XC5VLX50-3FF1153C is capable of being used in a variety of industries and applications. It can be used in military, aerospace, automotive, and industrial applications, as well as in communications, medical, and consumer electronics applications. This chip model is also suitable for use in advanced communication systems.
Regarding the industry trends of the chip model XC5VLX50-3FF1153C and the future development of related industries, it is important to take into account the specific technologies that are needed for the application environment. This chip model is designed to be compatible with a wide range of technologies, so it is likely that it can be used in the future with new technologies as they become available.
The original design intention of the chip model XC5VLX50-3FF1153C was to provide a powerful and versatile device that could be used in a variety of applications. It is designed to be highly reliable and efficient, and it is capable of being used in a wide range of applications. The chip model is also designed to be upgradable, so it is possible to upgrade the device in the future to take advantage of new technologies.
In conclusion, the chip model XC5VLX50-3FF1153C is a powerful and versatile device that is designed for high-performance digital signal processing, embedded processing, and image processing. It is suitable for use in a variety of industries and applications, and it is designed to be compatible with a wide range of technologies. It is also designed to be upgradable, so it is possible that it can be used in the future with new technologies as they become available.
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2,556 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,075.6008 | $1,075.6008 |
| 10+ | $1,064.0352 | $10,640.3520 |
| 100+ | $1,006.2072 | $100,620.7200 |
| 1000+ | $948.3792 | $474,189.6000 |
| 10000+ | $867.4200 | $867,420.0000 |
| The price is for reference only, please refer to the actual quotation! | ||