
AMD Xilinx
XC5VLX50-2FF324C
XC5VLX50-2FF324C ECAD Model
XC5VLX50-2FF324C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 220 | |
Number of Outputs | 220 | |
Number of Logic Cells | 46080 | |
Number of CLBs | 3600 | |
Combinatorial Delay of a CLB-Max | 770 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 3600 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm | |
Length | 19 mm | |
Seated Height-Max | 2.85 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | BGA-324 | |
Pin Count | 324 | |
ECCN Code | 3A991.D |
XC5VLX50-2FF324C Datasheet Download
XC5VLX50-2FF324C Overview
The XC5VLX50-2FF324C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to meet the needs of high-performance applications, and requires the use of HDL language. The chip model is part of a larger trend in the industry that is driving the development of more powerful and efficient computing solutions.
The XC5VLX50-2FF324C chip model is designed with a focus on flexibility and performance. It is capable of handling complex tasks, and its modular design allows for easy integration into existing systems. The chip model supports a wide range of technologies, including Ethernet, PCI Express, and USB. It also supports multiple clock speeds, allowing for increased performance and scalability.
The product description of the XC5VLX50-2FF324C chip model outlines the features and capabilities of the chip model. It also provides detailed information on the design requirements and the necessary technologies for successful implementation. The product description also includes a section on case studies and risk management. This section provides an overview of the implementation process, as well as the potential risks associated with the implementation.
As the demand for more powerful and efficient computing solutions continues to grow, the XC5VLX50-2FF324C chip model is well-positioned to meet the needs of a wide range of applications. The chip model is designed to be flexible and powerful, and its modular design allows for easy integration into existing systems. The product description outlines the features and capabilities of the chip model, and provides detailed information on the design requirements and necessary technologies for successful implementation. With its focus on flexibility and performance, the XC5VLX50-2FF324C chip model is a powerful tool for digital signal processing, embedded processing, and image processing.
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