XC5VLX50-2FF324C
XC5VLX50-2FF324C
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rohs

AMD Xilinx

XC5VLX50-2FF324C


XC5VLX50-2FF324C
F20-XC5VLX50-2FF324C
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA-324
BGA-324

XC5VLX50-2FF324C ECAD Model


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XC5VLX50-2FF324C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 220
Number of Outputs 220
Number of Logic Cells 46080
Number of CLBs 3600
Combinatorial Delay of a CLB-Max 770 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 3600 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2.85 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description BGA-324
Pin Count 324
ECCN Code 3A991.D

XC5VLX50-2FF324C Datasheet Download


XC5VLX50-2FF324C Overview



The XC5VLX50-2FF324C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to meet the needs of high-performance applications, and requires the use of HDL language. The chip model is part of a larger trend in the industry that is driving the development of more powerful and efficient computing solutions.


The XC5VLX50-2FF324C chip model is designed with a focus on flexibility and performance. It is capable of handling complex tasks, and its modular design allows for easy integration into existing systems. The chip model supports a wide range of technologies, including Ethernet, PCI Express, and USB. It also supports multiple clock speeds, allowing for increased performance and scalability.


The product description of the XC5VLX50-2FF324C chip model outlines the features and capabilities of the chip model. It also provides detailed information on the design requirements and the necessary technologies for successful implementation. The product description also includes a section on case studies and risk management. This section provides an overview of the implementation process, as well as the potential risks associated with the implementation.


As the demand for more powerful and efficient computing solutions continues to grow, the XC5VLX50-2FF324C chip model is well-positioned to meet the needs of a wide range of applications. The chip model is designed to be flexible and powerful, and its modular design allows for easy integration into existing systems. The product description outlines the features and capabilities of the chip model, and provides detailed information on the design requirements and necessary technologies for successful implementation. With its focus on flexibility and performance, the XC5VLX50-2FF324C chip model is a powerful tool for digital signal processing, embedded processing, and image processing.



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