
AMD Xilinx
XC5VLX330T-2FFG1738I
XC5VLX330T-2FFG1738I ECAD Model
XC5VLX330T-2FFG1738I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 960 | |
Number of Outputs | 960 | |
Number of Logic Cells | 331776 | |
Number of CLBs | 25920 | |
Combinatorial Delay of a CLB-Max | 770 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 25920 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1738 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1738 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1738,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-1738 | |
Pin Count | 1738 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC5VLX330T-2FFG1738I Datasheet Download
XC5VLX330T-2FFG1738I Overview
The XC5VLX330T-2FFG1738I chip model from Xilinx is a powerful and versatile device designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, making it a great choice for embedded systems.
The XC5VLX330T-2FFG1738I chip model is a great choice for those looking for a powerful and versatile device for their digital signal processing, embedded processing, and image processing needs. Its features include a high-performance processor, a large on-chip memory, and a wide range of I/O options. It also has an impressive array of features such as a high-speed clock, a multi-core processor, and an on-chip FPGA.
In terms of industry trends, the XC5VLX330T-2FFG1738I chip model is well-suited for the increasing demand for embedded systems. As the demand for embedded systems continues to grow, the need for powerful and versatile devices like the XC5VLX330T-2FFG1738I chip model will only continue to increase.
When it comes to product design and specific design requirements, the XC5VLX330T-2FFG1738I chip model offers a wide range of options. It is important to consider the specific needs of your project when designing a system that uses this chip model. Additionally, there are a variety of case studies and guidelines available online that can be used to help guide the design process.
When it comes to the application environment, it is important to consider the support of new technologies and their impact on the system. It is possible that the application environment may require the use of new technologies or the integration of existing ones. It is important to consider how these technologies will affect the system and its performance.
Overall, the XC5VLX330T-2FFG1738I chip model is a great choice for those looking for a powerful and versatile device for their digital signal processing, embedded processing, and image processing needs. Its features and design make it an ideal device for a wide range of applications. It is important to consider the specific needs of your project and the application environment when designing a system that uses this chip model. With the right design and support, this chip model can be a great choice for embedded systems.
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