AMD Xilinx
XC5VLX330T-2FF1738I
XC5VLX330T-2FF1738I ECAD Model
XC5VLX330T-2FF1738I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 960 | |
| Number of Outputs | 960 | |
| Number of Logic Cells | 331776 | |
| Number of CLBs | 25920 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 25920 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1738 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1738 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1738,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA-1738 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1738 |
XC5VLX330T-2FF1738I Datasheet Download
XC5VLX330T-2FF1738I Overview
The XC5VLX330T-2FF1738I chip model is a powerful, cost-effective device designed to meet the needs of the most demanding applications. The chip model is designed to be used in a wide range of applications, from consumer electronics to industrial automation. It is capable of delivering high-performance and reliable operation in a wide range of environments.
The XC5VLX330T-2FF1738I chip model is equipped with a wide range of features. It is capable of delivering high-performance and reliable operation in a wide range of environments. It offers a low power consumption, low noise, and low-cost design, making it an ideal choice for applications such as consumer electronics, industrial automation, and networking. The chip model also offers excellent scalability and flexibility, allowing for easy integration into existing systems.
The XC5VLX330T-2FF1738I chip model is expected to be in high demand in the future, as it is perfect for use in many intelligent scenarios. The chip model is ideal for use in networks, as it is able to deliver high-performance and reliable operation in a wide range of environments. It is also perfect for use in the era of fully intelligent systems, as it is capable of delivering high-performance and reliable operation in a wide range of environments.
The XC5VLX330T-2FF1738I chip model is designed to meet the needs of the most demanding applications. It is equipped with a wide range of features, including low power consumption, low noise, and low-cost design. In addition, it offers excellent scalability and flexibility, allowing for easy integration into existing systems. The chip model is also equipped with a wide range of safety features, such as ESD protection, overvoltage protection, and overcurrent protection.
In order to ensure that the XC5VLX330T-2FF1738I chip model is properly used and implemented, there are certain design requirements that need to be taken into consideration. These include the power supply voltage, the operating temperature range, the maximum frequency of operation, and the maximum current consumption. In addition, it is important to consider the specific application in which the chip model will be used, in order to ensure that it is properly implemented.
The XC5VLX330T-2FF1738I chip model has been successfully used in a variety of applications, including consumer electronics, industrial automation, and networking. In addition, it has been used in a variety of intelligent scenarios, such as self-driving cars, smart home systems, and intelligent medical systems. In each of these cases, the chip model has been able to deliver high-performance and reliable operation in a wide range of environments.
In conclusion, the XC5VLX330T-2FF1738I chip model is a powerful, cost-effective device designed to meet the needs of the most demanding applications. It is equipped with a wide range of features, including low power consumption, low noise, and low-cost design. In addition, it offers excellent scalability and flexibility, allowing for easy integration into existing systems. The chip model is expected to be in high demand in the future, as it is perfect for use in many intelligent scenarios. In order to ensure that the chip model is properly used and implemented, there are certain design requirements that need to be taken into consideration. The chip model has been successfully used in a variety of applications and intelligent scenarios, demonstrating its capability to deliver high-performance and reliable operation in a wide range of environments.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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