
AMD Xilinx
XC5VLX330-3FF1760I
XC5VLX330-3FF1760I ECAD Model
XC5VLX330-3FF1760I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | TIN LEAD | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC5VLX330-3FF1760I Datasheet Download
XC5VLX330-3FF1760I Overview
The Xilinx XC5VLX330-3FF1760I chip model is a highly advanced programmable logic device designed for high-performance applications. It is the latest in the family of Xilinx FPGA devices, and offers the highest level of performance and flexibility. The chip is capable of handling a wide range of tasks, from basic logic operations to complex system-level designs. It is also capable of supporting a variety of communication protocols and is suitable for a range of applications.
The XC5VLX330-3FF1760I chip model is an ideal choice for applications that require high-speed data transfer and processing. It is capable of supporting multiple high-speed communication protocols, such as PCI Express, Ethernet, and USB. Its high-speed operation makes it suitable for advanced communication systems, allowing for faster data transfer and processing. Additionally, its flexibility and scalability make it suitable for future upgrades, allowing for the addition of more features and capabilities as needed.
The XC5VLX330-3FF1760I chip model is also suitable for use in intelligent networks and scenarios. Its high-speed operation and flexibility make it capable of supporting a wide range of intelligent applications, from basic logic operations to complex system-level designs. Furthermore, its scalability and flexibility make it suitable for use in the era of fully intelligent systems. This chip model is capable of handling a wide range of tasks and is suitable for the development and popularization of future intelligent robots.
Using the XC5VLX330-3FF1760I chip model effectively requires a certain level of technical talent. It is important to understand the various communication protocols and how to configure the chip model for different applications. Additionally, it is important to understand the various system-level designs and how to properly integrate the chip model into them. With the right technical talents, the XC5VLX330-3FF1760I chip model can be used to create highly advanced and powerful applications.
1,664 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,508.7680 | $2,508.7680 |
10+ | $2,481.7920 | $24,817.9200 |
100+ | $2,346.9120 | $234,691.2000 |
1000+ | $2,212.0320 | $1,106,016.0000 |
10000+ | $2,023.2000 | $2,023,200.0000 |
The price is for reference only, please refer to the actual quotation! |