AMD Xilinx
XC5VLX330-2FFG1760I
XC5VLX330-2FFG1760I ECAD Model
XC5VLX330-2FFG1760I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 331776 | |
| Number of CLBs | 25920 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 25920 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5VLX330-2FFG1760I Datasheet Download
XC5VLX330-2FFG1760I Overview
The chip model XC5VLX330-2FFG1760I is a Field Programmable Gate Array (FPGA) developed by Xilinx Inc. It is a high-performance, low-cost, and low-power FPGA chip that provides a wide range of features and capabilities. It is designed to be used in a variety of applications such as industrial automation, medical imaging, automotive, aerospace, and consumer electronics.
The XC5VLX330-2FFG1760I has several advantages that make it a great choice for a variety of applications. It is a high-performance chip that can support a wide range of functions and features, including high-speed data transfer and advanced signal processing. It is also cost-effective and energy-efficient, making it a great choice for applications that require low power consumption. Additionally, the chip model is designed to be easily upgradable, making it a great option for applications that may require additional features or capabilities in the future.
The chip model is expected to see increasing demand in the future as the need for advanced communication systems increases. The chip model provides the necessary features and capabilities to meet the needs of these advanced communication systems, such as high-speed data transfer and advanced signal processing. Additionally, the chip model is designed to be upgradable, so it can be easily adapted to new technologies as they become available.
The original design intention of the XC5VLX330-2FFG1760I was to provide a high-performance, cost-effective, and energy-efficient FPGA chip that could be used in a variety of applications. The chip model has been successful in meeting these goals, and its upgradability makes it a great choice for applications that require new technologies or features. Additionally, the chip model is expected to see increasing demand in the future, as advanced communication systems become more prevalent and require the features and capabilities that the chip model provides. With its upgradability, the chip model is well-suited to meet the needs of these advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||