
AMD Xilinx
XC5VLX30T-3FFG323C
XC5VLX30T-3FFG323C ECAD Model
XC5VLX30T-3FFG323C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 172 | |
Number of Outputs | 172 | |
Number of Logic Cells | 30720 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 2400 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B323 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 323 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA323,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm | |
Length | 19 mm | |
Seated Height-Max | 2.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-323 | |
Pin Count | 323 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC5VLX30T-3FFG323C Datasheet Download
XC5VLX30T-3FFG323C Overview
The Xilinx XC5VLX30T-3FFG323C chip is an advanced FPGA device that has been designed to meet the needs of a wide range of applications. It is based on a Virtex-5 FPGA platform and is a high performance, low power, and highly integrated device. The device is suitable for a variety of applications including digital signal processing, image processing, communication systems, and embedded systems.
The XC5VLX30T-3FFG323C chip is designed with the intention of providing a highly integrated, high performance, and low power solution for a wide range of applications. It has a wide range of features including high speed transceivers, embedded memory, DSP blocks, and high speed I/Os. The chip also features a low power consumption, making it ideal for applications that require low power operation.
The XC5VLX30T-3FFG323C chip has already been used in a variety of applications and has been proven to be reliable and efficient. The device has been used in digital signal processing, image processing, communication systems, and embedded systems. The device has also been used in a variety of industrial applications, including automotive, medical, and aerospace applications.
The XC5VLX30T-3FFG323C chip is expected to see increasing demand in the future due to its high performance, low power consumption, and highly integrated design. The device is also expected to be used in more advanced communication systems, such as 5G and 6G networks, due to its high speed transceivers and embedded memory.
The XC5VLX30T-3FFG323C chip is designed to meet specific design requirements. It features a wide range of features, including high speed transceivers, embedded memory, DSP blocks, and high speed I/Os. The device also features a low power consumption, making it ideal for applications that require low power operation. The device also features a wide range of I/O options, allowing it to be used in a variety of applications.
In order to ensure the successful implementation of the XC5VLX30T-3FFG323C chip, it is important to consider the design requirements of the application. This includes the power requirements, the speed requirements, and the I/O requirements. It is also important to consider the potential for future upgrades, as the device can be upgraded to meet the needs of more advanced applications.
There have been a number of case studies that have been conducted on the XC5VLX30T-3FFG323C chip. These studies have highlighted the performance, reliability, and power consumption of the device. The studies have also highlighted the potential for future upgrades, as the device can be upgraded to meet the needs of more advanced applications.
When using the XC5VLX30T-3FFG323C chip, it is important to take certain precautions. It is important to ensure that the device is used in a controlled environment and that it is not exposed to extreme temperatures or humidity. It is also important to ensure that the device is properly powered and that all connections are secure. Finally, it is important to ensure that the device is properly programmed and that all necessary software is up to date.
The XC5VLX30T-3FFG323C chip is an advanced FPGA device that has been designed to meet the needs of a wide range of applications. It is highly integrated, high performance, and low power, making it ideal for a variety of applications. The device is expected to see increasing demand in the future due to its features and potential for future upgrades. It is important to consider the design requirements of the application and to take certain precautions when using the device.
You May Also Be Interested In
2,397 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $508.7472 | $508.7472 |
10+ | $503.2768 | $5,032.7680 |
100+ | $475.9248 | $47,592.4800 |
1000+ | $448.5728 | $224,286.4000 |
10000+ | $410.2800 | $410,280.0000 |
The price is for reference only, please refer to the actual quotation! |