XC5VLX30T-3FFG323C
XC5VLX30T-3FFG323C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC5VLX30T-3FFG323C


XC5VLX30T-3FFG323C
F20-XC5VLX30T-3FFG323C
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA-323
BGA-323

XC5VLX30T-3FFG323C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC5VLX30T-3FFG323C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 172
Number of Outputs 172
Number of Logic Cells 30720
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 670 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 2400 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B323
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 323
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA323,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-323
Pin Count 323
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC5VLX30T-3FFG323C Datasheet Download


XC5VLX30T-3FFG323C Overview



The Xilinx XC5VLX30T-3FFG323C chip is an advanced FPGA device that has been designed to meet the needs of a wide range of applications. It is based on a Virtex-5 FPGA platform and is a high performance, low power, and highly integrated device. The device is suitable for a variety of applications including digital signal processing, image processing, communication systems, and embedded systems.


The XC5VLX30T-3FFG323C chip is designed with the intention of providing a highly integrated, high performance, and low power solution for a wide range of applications. It has a wide range of features including high speed transceivers, embedded memory, DSP blocks, and high speed I/Os. The chip also features a low power consumption, making it ideal for applications that require low power operation.


The XC5VLX30T-3FFG323C chip has already been used in a variety of applications and has been proven to be reliable and efficient. The device has been used in digital signal processing, image processing, communication systems, and embedded systems. The device has also been used in a variety of industrial applications, including automotive, medical, and aerospace applications.


The XC5VLX30T-3FFG323C chip is expected to see increasing demand in the future due to its high performance, low power consumption, and highly integrated design. The device is also expected to be used in more advanced communication systems, such as 5G and 6G networks, due to its high speed transceivers and embedded memory.


The XC5VLX30T-3FFG323C chip is designed to meet specific design requirements. It features a wide range of features, including high speed transceivers, embedded memory, DSP blocks, and high speed I/Os. The device also features a low power consumption, making it ideal for applications that require low power operation. The device also features a wide range of I/O options, allowing it to be used in a variety of applications.


In order to ensure the successful implementation of the XC5VLX30T-3FFG323C chip, it is important to consider the design requirements of the application. This includes the power requirements, the speed requirements, and the I/O requirements. It is also important to consider the potential for future upgrades, as the device can be upgraded to meet the needs of more advanced applications.


There have been a number of case studies that have been conducted on the XC5VLX30T-3FFG323C chip. These studies have highlighted the performance, reliability, and power consumption of the device. The studies have also highlighted the potential for future upgrades, as the device can be upgraded to meet the needs of more advanced applications.


When using the XC5VLX30T-3FFG323C chip, it is important to take certain precautions. It is important to ensure that the device is used in a controlled environment and that it is not exposed to extreme temperatures or humidity. It is also important to ensure that the device is properly powered and that all connections are secure. Finally, it is important to ensure that the device is properly programmed and that all necessary software is up to date.


The XC5VLX30T-3FFG323C chip is an advanced FPGA device that has been designed to meet the needs of a wide range of applications. It is highly integrated, high performance, and low power, making it ideal for a variety of applications. The device is expected to see increasing demand in the future due to its features and potential for future upgrades. It is important to consider the design requirements of the application and to take certain precautions when using the device.



2,397 In Stock


I want to buy

Unit Price: $547.04
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $508.7472 $508.7472
10+ $503.2768 $5,032.7680
100+ $475.9248 $47,592.4800
1000+ $448.5728 $224,286.4000
10000+ $410.2800 $410,280.0000
The price is for reference only, please refer to the actual quotation!

Quick Quote