AMD Xilinx
XC5VLX30T-3FF323C
XC5VLX30T-3FF323C ECAD Model
XC5VLX30T-3FF323C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 30720 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 670 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 2400 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B323 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 323 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA323,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | BGA-323 | |
| Pin Count | 323 | |
| ECCN Code | EAR99 |
XC5VLX30T-3FF323C Datasheet Download
XC5VLX30T-3FF323C Overview
The XC5VLX30T-3FF323C chip model is a high-performance, low-power FPGA device from Xilinx that can be used in a variety of applications such as digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL language, allowing for high levels of flexibility and customization. The XC5VLX30T-3FF323C chip model is designed for use in a variety of high-end applications, including communications, medical imaging, and industrial automation.
The original design intention of the XC5VLX30T-3FF323C chip model was to provide a powerful and efficient solution for digital signal processing and embedded processing applications. The device is capable of supporting multiple high-speed serial protocols, making it ideal for use in advanced communication systems. In addition, the device is designed with a high level of scalability, allowing it to be upgraded in the future to meet changing requirements.
The XC5VLX30T-3FF323C chip model can also be used in the development of future intelligent robots. The device is capable of supporting a wide range of digital signal processing functions, allowing for the creation of complex algorithms and programs. To use the device effectively, a variety of technical talents are required, such as hardware engineers, software engineers, and machine learning experts.
In conclusion, the XC5VLX30T-3FF323C chip model is a powerful and efficient FPGA device from Xilinx that can be used in a variety of applications, including digital signal processing, embedded processing, and image processing. The device is designed to be programmed using the HDL language, allowing for high levels of flexibility and customization. The device is also designed with a high level of scalability, making it ideal for use in advanced communication systems and the development of future intelligent robots.
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3,446 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,315.7052 | $1,315.7052 |
| 10+ | $1,301.5579 | $13,015.5786 |
| 100+ | $1,230.8210 | $123,082.1016 |
| 1000+ | $1,160.0842 | $580,042.0880 |
| 10000+ | $1,061.0526 | $1,061,052.6000 |
| The price is for reference only, please refer to the actual quotation! | ||