XC5VLX30-2FFG324C
XC5VLX30-2FFG324C
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rohs

AMD Xilinx

XC5VLX30-2FFG324C


XC5VLX30-2FFG324C
F20-XC5VLX30-2FFG324C
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA-324
BGA-324

XC5VLX30-2FFG324C ECAD Model


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XC5VLX30-2FFG324C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 220
Number of Outputs 220
Number of Logic Cells 30720
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 770 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 2400 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-324
Pin Count 324
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC5VLX30-2FFG324C Datasheet Download


XC5VLX30-2FFG324C Overview



The XC5VLX30-2FFG324C chip model is a powerful and advanced model developed by the technology giant Xilinx. It has a wide range of applications, from communication systems to intelligent robots. This chip model is specially designed to meet the needs of the industry for high-performance computing, communication, and storage. It provides an ideal solution for the development of advanced communication systems and intelligent robots.


The XC5VLX30-2FFG324C chip model has a number of advantages over other models. Its design is based on the latest technology, which enables it to achieve high performance. It is also designed to be power-efficient, which means it can be used in a wide range of applications without consuming too much power. Moreover, it is also designed to be highly reliable, which means it can be used in a variety of applications without any risk of failure.


The XC5VLX30-2FFG324C chip model is expected to have a growing demand in the future. It is perfect for the development of advanced communication systems, which are becoming increasingly important in the modern world. It is also ideal for the development and popularization of future intelligent robots. The chip model is also expected to be upgraded in the future to meet the needs of the industry for more advanced models.


In order to use the XC5VLX30-2FFG324C chip model effectively, certain technical talents are required. These include knowledge of programming languages, such as C++ and Java, as well as knowledge of hardware design and implementation. Additionally, knowledge of the current trends in the industry is also important in order to ensure that the model is used in the most effective way.


Overall, the XC5VLX30-2FFG324C chip model is a powerful and advanced model developed by Xilinx. It is designed to provide an ideal solution for the development of advanced communication systems and intelligent robots. It has a number of advantages, including high performance, power efficiency, and reliability. It is also expected to have a growing demand in the future, and it can be upgraded to meet the needs of the industry for more advanced models. In order to use the model effectively, certain technical talents are required.



5,441 In Stock


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Unit Price: $325.52
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $302.7336 $302.7336
10+ $299.4784 $2,994.7840
100+ $283.2024 $28,320.2400
1000+ $266.9264 $133,463.2000
10000+ $244.1400 $244,140.0000
The price is for reference only, please refer to the actual quotation!

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