AMD Xilinx
XC5VLX30-1FF324C
XC5VLX30-1FF324C ECAD Model
XC5VLX30-1FF324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 220 | |
| Number of Outputs | 220 | |
| Number of Logic Cells | 30720 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 2400 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC5VLX30-1FF324C Datasheet Download
XC5VLX30-1FF324C Overview
The XC5VLX30-1FF324C chip model is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, and its application scenarios are suitable for many different industries.
The chip model XC5VLX30-1FF324C is an important part of the industry trend, and its development and popularization can be seen in many industries. In order to make full use of the chip model, it is necessary to have an understanding of the industry trends and the future development of related industries. Furthermore, the application environment may require the support of new technologies, such as artificial intelligence, machine learning, and big data.
The chip model XC5VLX30-1FF324C can be applied to the development and popularization of future intelligent robots. This is because the chip model is powerful enough to handle the complex tasks required by robots. In order to use the model effectively, technical talents are needed who are familiar with the chip model and the related technologies. These talents should have a strong understanding of the chip model, as well as the ability to develop and debug programs. Additionally, they should be able to use the model to control and optimize the performance of the robot.
In conclusion, the chip model XC5VLX30-1FF324C is a powerful and versatile chip that is suitable for many different industries. It is an important part of the industry trend and can be applied to the development and popularization of future intelligent robots. In order to make full use of the chip model, it is necessary to have an understanding of the industry trends and the future development of related industries, as well as the technical talents needed to use the model effectively.
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2,435 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $241.8000 | $241.8000 |
| 10+ | $239.2000 | $2,392.0000 |
| 100+ | $226.2000 | $22,620.0000 |
| 1000+ | $213.2000 | $106,600.0000 |
| 10000+ | $195.0000 | $195,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||