XC5VLX220-2FF1760C
XC5VLX220-2FF1760C
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rohs

AMD Xilinx

XC5VLX220-2FF1760C


XC5VLX220-2FF1760C
F20-XC5VLX220-2FF1760C
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA-1760
BGA-1760

XC5VLX220-2FF1760C ECAD Model


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XC5VLX220-2FF1760C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 800
Number of Outputs 800
Number of Logic Cells 221184
Number of CLBs 17280
Combinatorial Delay of a CLB-Max 770 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 17280 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-1760
Pin Count 1760
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC5VLX220-2FF1760C Datasheet Download


XC5VLX220-2FF1760C Overview



The XC5VLX220-2FF1760C chip model is an advanced integrated circuit device that has been developed to meet the growing demand for high-performance, low-power, and cost-effective solutions in the electronic industry. It is a highly integrated, low-power, and high-performance field-programmable gate array (FPGA) chip that is designed to meet the needs of many applications.


This chip model is equipped with a very efficient and powerful processor core, which is capable of performing a wide variety of tasks. It also features a high-speed I/O interface, which can be used for a variety of data transfer operations. Additionally, the chip model is also equipped with a high-performance memory controller, which can be used to store large amounts of data and provide fast access to it.


The XC5VLX220-2FF1760C chip model has several advantages over other similar products. It has a low power consumption, which makes it ideal for use in mobile devices. It is also highly reliable and has a long life expectancy, which makes it a great choice for long-term use. Furthermore, it is relatively inexpensive compared to other similar products, making it an attractive option for many applications.


In terms of expected demand trends in the future, the XC5VLX220-2FF1760C chip model is expected to be in high demand in the coming years. This is due to the fact that it is a highly efficient, low-power, and cost-effective solution for many applications. Additionally, the chip model is expected to be used in a variety of applications, including automotive, industrial, and consumer electronics. Furthermore, the chip model is expected to be used in the development and popularization of future intelligent robots, as it is capable of performing a wide variety of tasks.


In terms of product description and specific design requirements, the XC5VLX220-2FF1760C chip model is a highly integrated, low-power, and high-performance FPGA chip. It is equipped with a very efficient and powerful processor core, a high-speed I/O interface, and a high-performance memory controller. Additionally, the chip model has a low power consumption and a long life expectancy, making it a great choice for long-term use.


When using the XC5VLX220-2FF1760C chip model, it is important to keep in mind certain precautions. For example, it is important to make sure that the chip is properly connected to the power supply and that all necessary components are correctly connected. Additionally, it is important to ensure that the chip is not exposed to excessive heat or moisture, as this can damage the chip.


In conclusion, the XC5VLX220-2FF1760C chip model is an advanced integrated circuit device that has been developed to meet the growing demand for high-performance, low-power, and cost-effective solutions in the electronic industry. It has several advantages, including a low power consumption, high reliability, and a long life expectancy. It is expected to be in high demand in the coming years, as it is a highly efficient, low-power, and cost-effective solution for many applications. Furthermore, it can be used in the development and popularization of future intelligent robots, and those who wish to use the chip model effectively should have a good understanding of its design requirements and the necessary precautions.



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Unit Price: $4,458.504
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,146.4087 $4,146.4087
10+ $4,101.8237 $41,018.2368
100+ $3,878.8985 $387,889.8480
1000+ $3,655.9733 $1,827,986.6400
10000+ $3,343.8780 $3,343,878.0000
The price is for reference only, please refer to the actual quotation!

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