
AMD Xilinx
XC5VLX20T-2FF323I
XC5VLX20T-2FF323I ECAD Model
XC5VLX20T-2FF323I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 172 | |
Number of Outputs | 172 | |
Number of Logic Cells | 19968 | |
Number of CLBs | 1560 | |
Combinatorial Delay of a CLB-Max | 770 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1560 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B323 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 323 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA323,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm | |
Length | 19 mm | |
Seated Height-Max | 2.85 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | BGA-323 | |
Pin Count | 323 |
XC5VLX20T-2FF323I Datasheet Download
XC5VLX20T-2FF323I Overview
The XC5VLX20T-2FF323I chip model is a powerful and versatile device that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. This chip requires the use of the HDL language for programming and implementation.
As with any technology, the performance of the XC5VLX20T-2FF323I chip model is constantly evolving and adapting to the changing needs of the industry. Whether new technologies are needed to support the application environment of the chip model depends on what specific technologies are needed for the application.
The original design intention of the XC5VLX20T-2FF323I chip model was to provide a powerful, versatile device that could meet the needs of a variety of applications. As technology advances, it is possible that the chip model could be upgraded to support more advanced features and capabilities. Whether the chip model can be applied to advanced communication systems depends on the specific requirements of the system.
The XC5VLX20T-2FF323I chip model is a powerful and versatile device that is well-suited for a variety of applications. As technology advances, it is possible that the chip model could be upgraded to support more advanced features and capabilities. Whether new technologies are needed to support the application environment of the chip model depends on what specific technologies are needed for the application. The original design intention of the XC5VLX20T-2FF323I chip model was to provide a powerful, versatile device that could meet the needs of a variety of applications. Whether the chip model can be applied to advanced communication systems depends on the specific requirements of the system.
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5,064 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $383.0112 | $383.0112 |
10+ | $378.8928 | $3,788.9280 |
100+ | $358.3008 | $35,830.0800 |
1000+ | $337.7088 | $168,854.4000 |
10000+ | $308.8800 | $308,880.0000 |
The price is for reference only, please refer to the actual quotation! |