
AMD Xilinx
XC5VLX155-3FFG1760C
XC5VLX155-3FFG1760C ECAD Model
XC5VLX155-3FFG1760C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 800 | |
Number of Outputs | 800 | |
Number of Logic Cells | 155648 | |
Number of CLBs | 12160 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 12160 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-1760 | |
Pin Count | 1760 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC5VLX155-3FFG1760C Datasheet Download
XC5VLX155-3FFG1760C Overview
The XC5VLX155-3FFG1760C chip model is a powerful and versatile tool that can be used in a variety of industries and applications. It is a highly advanced and sophisticated model that offers a range of benefits and features that make it an ideal choice for many applications.
The XC5VLX155-3FFG1760C chip model is designed to be used in a wide variety of networks and intelligent scenarios. It is capable of supporting high-speed data transfer and can be used to provide efficient and reliable communication between devices. It is also capable of supporting advanced security protocols and can be used to protect sensitive data and networks.
The XC5VLX155-3FFG1760C chip model is expected to be in high demand in the future as more industries and applications embrace the use of intelligent systems. It is capable of supporting the development of sophisticated intelligent systems, and its advanced features and capabilities make it an ideal choice for many applications. It is also capable of supporting the development and popularization of future intelligent robots, and its advanced capabilities make it an ideal choice for these applications.
In order to effectively use the XC5VLX155-3FFG1760C chip model, it is important to have the right technical skills and knowledge. Those who are familiar with the chip model should have a good understanding of its features and capabilities, as well as its potential applications. It is also important to have a good understanding of the various networks and intelligent scenarios that the chip model can be applied to.
Overall, the XC5VLX155-3FFG1760C chip model is a powerful and versatile tool that can be used in a variety of industries and applications. It is expected to be in high demand in the future as more industries and applications embrace the use of intelligent systems. It is capable of supporting the development and popularization of future intelligent robots, and its advanced features and capabilities make it an ideal choice for many applications. In order to effectively use the XC5VLX155-3FFG1760C chip model, it is important to have the right technical skills and knowledge.
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5,818 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,442.6814 | $3,442.6814 |
10+ | $3,405.6634 | $34,056.6336 |
100+ | $3,220.5730 | $322,057.2960 |
1000+ | $3,035.4826 | $1,517,741.2800 |
10000+ | $2,776.3560 | $2,776,356.0000 |
The price is for reference only, please refer to the actual quotation! |