
AMD Xilinx
XC5VLX155-3FF1760C
XC5VLX155-3FF1760C ECAD Model
XC5VLX155-3FF1760C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 800 | |
Number of Outputs | 800 | |
Number of Logic Cells | 155648 | |
Number of CLBs | 12160 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 12160 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | BGA-1760 | |
Pin Count | 1760 | |
ECCN Code | 3A001.A.7.A |
XC5VLX155-3FF1760C Datasheet Download
XC5VLX155-3FF1760C Overview
The XC5VLX155-3FF1760C chip model is a powerful and versatile component that is suitable for a wide range of applications. It is ideal for high-performance digital signal processing, embedded processing, image processing, and other tasks that require the use of HDL language.
The XC5VLX155-3FF1760C chip model is a cutting-edge component that offers a range of features and capabilities. It is ideal for applications that require high-speed processing, low power consumption, and a wide range of features. It is also designed to be compatible with a range of operating systems and development tools.
The XC5VLX155-3FF1760C chip model is an excellent choice for applications that require the use of advanced technologies. It is capable of supporting a wide range of technologies, including the latest in AI, machine learning, and other cutting-edge technologies. It is also capable of supporting a variety of operating systems and development tools.
The XC5VLX155-3FF1760C chip model is a great choice for those who are looking for a reliable and efficient component. It is designed to be reliable, efficient, and cost-effective. It is also designed to be compatible with a variety of operating systems and development tools.
The product description of the XC5VLX155-3FF1760C chip model provides a detailed overview of the features and capabilities of the component. It also provides an overview of the design requirements and actual case studies. It also provides a list of precautions that should be taken when using the component.
The future development of the XC5VLX155-3FF1760C chip model and the related industries will depend on the specific technologies that are needed. It is likely that new technologies will be needed to support the application environment. It is important to keep up with the latest developments in order to ensure that the component is able to meet the current and future needs of the application.
In conclusion, the XC5VLX155-3FF1760C chip model is a powerful and versatile component that is suitable for a wide range of applications. It is designed to be reliable, efficient, and cost-effective. It is also capable of supporting a wide range of technologies, including the latest in AI, machine learning, and other cutting-edge technologies. It is important to keep up with the latest developments in order to ensure that the component is able to meet the current and future needs of the application.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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