AMD Xilinx
XC5VLX155-2FFG1760I
XC5VLX155-2FFG1760I ECAD Model
XC5VLX155-2FFG1760I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 800 | |
| Number of Outputs | 800 | |
| Number of Logic Cells | 155648 | |
| Number of CLBs | 12160 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 12160 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC5VLX155-2FFG1760I Datasheet Download
XC5VLX155-2FFG1760I Overview
The XC5VLX155-2FFG1760I chip model is a powerful processor that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and has the advantage of being able to handle complex tasks. This chip model is also capable of being used in advanced communication systems.
The XC5VLX155-2FFG1760I chip model is expected to be in high demand in the future due to its powerful capabilities and its ability to handle complex tasks. It is also capable of being upgraded in the future, making it a great choice for those who need a processor that can keep up with the latest technologies.
The original design intention of the XC5VLX155-2FFG1760I chip model was to create a processor that was capable of handling complex tasks and was able to be used in advanced communication systems. This chip model was designed to be used with the HDL language, allowing it to be used in a wide variety of applications.
The XC5VLX155-2FFG1760I chip model is a powerful processor that is expected to be in high demand in the future. It has the advantage of being able to handle complex tasks and is capable of being upgraded in the future. This chip model is also capable of being used in advanced communication systems, making it a great choice for those who need a powerful processor that can keep up with the latest technologies.
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1,117 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,442.6814 | $3,442.6814 |
| 10+ | $3,405.6634 | $34,056.6336 |
| 100+ | $3,220.5730 | $322,057.2960 |
| 1000+ | $3,035.4826 | $1,517,741.2800 |
| 10000+ | $2,776.3560 | $2,776,356.0000 |
| The price is for reference only, please refer to the actual quotation! | ||