
AMD Xilinx
XC5VLX155-2FFG1760C
XC5VLX155-2FFG1760C ECAD Model
XC5VLX155-2FFG1760C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-5 LX | |
Package | Tray | |
Number of LABs/CLBs | 12160 | |
Number of Logic Elements/Cells | 155648 | |
Total RAM Bits | 7077888 | |
Number of I/O | 800 | |
Voltage - Supply | 0.95V ~ 1.05V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1760-BBGA, FCBGA | |
Supplier Device Package | 1760-FCBGA (42.5x42.5) | |
Base Product Number | XC5VLX155 |
XC5VLX155-2FFG1760C Datasheet Download
XC5VLX155-2FFG1760C Overview
The XC5VLX155-2FFG1760C is a field programmable gate array (FPGA) chip manufactured by Xilinx Inc. It is a member of the Virtex-5 family of FPGAs and is based on the 65-nanometer process. The chip has a total of 1760 logic cells, with 155 I/O pins. It is available in a flip-chip ball grid array package with a footprint of 17x17mm.
The chip is designed for high-performance applications such as digital signal processing, video, imaging, networking, and other high-speed data processing applications. It features a high-speed, low-power architecture that is capable of operating at up to 300MHz. It also features a wide range of I/O options, including LVDS, SSTL, and PCI Express. The chip also has a range of embedded memory blocks, including Block RAM, FIFO, and Dual-Port RAM, as well as a range of DSP blocks.
The chip is designed for a range of applications, including automotive, industrial, medical, aerospace, and communications. It is suitable for use in high-speed data processing applications, such as high-definition video processing, image processing, and networking. The chip is also suitable for use in applications such as motor control and robotics. The chip is also suitable for use in industrial automation and control systems.
In summary, the XC5VLX155-2FFG1760C is a 65-nanometer FPGA chip from Xilinx Inc. It has 1760 logic cells and 155 I/O pins, and is available in a flip-chip ball grid array package. The chip is designed for high-performance applications, and features a high-speed, low-power architecture that is capable of operating at up to 300MHz. It is suitable for use in a range of applications, including automotive, industrial, medical, aerospace, and communications.
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2,825 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,912.3698 | $10,912.3698 |
10+ | $10,795.0325 | $107,950.3252 |
100+ | $10,208.3460 | $1,020,834.5970 |
1000+ | $9,621.6594 | $4,810,829.7100 |
10000+ | $8,800.2983 | $8,800,298.2500 |
The price is for reference only, please refer to the actual quotation! |