AMD Xilinx
XC5VLX110T-3FF1738I
XC5VLX110T-3FF1738I ECAD Model
XC5VLX110T-3FF1738I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 680 | |
| Number of Outputs | 680 | |
| Number of Logic Cells | 8640 | |
| Number of CLBs | 8640 | |
| Combinatorial Delay of a CLB-Max | 670 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 710 MHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1738 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1738 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1738,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5VLX110T-3FF1738I Datasheet Download
XC5VLX110T-3FF1738I Overview
The XC5VLX110T-3FF1738I chip model is a highly advanced and complex integrated circuit designed to provide a wide range of capabilities and features. It is designed to meet the needs of advanced communication systems, providing a high level of performance and reliability.
The original design intention of the XC5VLX110T-3FF1738I chip model was to provide a powerful and reliable solution for advanced communication systems. It has been designed with a wide range of features and capabilities, including high-speed data transfer, low power consumption, and a high level of signal fidelity. It is capable of supporting a wide range of applications, including high-speed data transfer, voice and video transmission, and multimedia streaming.
The XC5VLX110T-3FF1738I chip model is also capable of being upgraded in the future. This chip model is designed with a modular architecture, allowing for easy upgrades and modifications. It is also capable of being used in advanced communication systems, such as those used in 5G networks.
The product description and specific design requirements of the XC5VLX110T-3FF1738I chip model can be found in the product documentation. This documentation provides detailed information on the chip model's capabilities, performance requirements, and design specifications. It also provides actual case studies and precautions for using the chip model.
The XC5VLX110T-3FF1738I chip model can also be applied to the development and popularization of future intelligent robots. This chip model is designed with a wide range of features and capabilities, including high-speed data transfer, low power consumption, and a high level of signal fidelity. It is capable of supporting a wide range of applications, including high-speed data transfer, voice and video transmission, and multimedia streaming.
In order to use the XC5VLX110T-3FF1738I chip model effectively, a range of technical talents are needed. These include experienced engineers with a deep understanding of integrated circuit design, as well as software developers with knowledge of programming languages such as Python and C++. Additionally, knowledge of robotics and artificial intelligence may be required for the development of future intelligent robots.
In conclusion, the XC5VLX110T-3FF1738I chip model is a highly advanced and complex integrated circuit designed to provide a wide range of capabilities and features. It is designed to meet the needs of advanced communication systems, providing a high level of performance and reliability. It is also capable of being upgraded in the future, and can be applied to the development and popularization of future intelligent robots. To use the chip model effectively, a range of technical talents are needed, including experienced engineers and software developers.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||