AMD Xilinx
XC5VLX110T-3FF1738C
XC5VLX110T-3FF1738C ECAD Model
XC5VLX110T-3FF1738C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 680 | |
| Number of Outputs | 680 | |
| Number of Logic Cells | 110592 | |
| Number of CLBs | 8640 | |
| Combinatorial Delay of a CLB-Max | 670 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 8640 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1738 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1738 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1738,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | BGA-1738 | |
| Pin Count | 1738 | |
| ECCN Code | 3A991.D |
XC5VLX110T-3FF1738C Datasheet Download
XC5VLX110T-3FF1738C Overview
The XC5VLX110T-3FF1738C chip model is a powerful tool for digital signal processing, embedded processing, image processing, and other related tasks. It is designed to be used with the HDL language, which is a hardware description language that allows for the precise description of digital systems. The chip model is capable of handling complex tasks, making it an ideal choice for high-performance applications.
The XC5VLX110T-3FF1738C chip model has several advantages that make it an attractive choice for many industries. The chip model has a high speed and low power consumption, making it a great choice for applications that require high performance with minimal energy consumption. It also offers a high degree of scalability, meaning that it can be used for a wide range of tasks. Additionally, the chip model is highly reliable and has a long life expectancy, making it a great option for those who need a reliable solution.
The demand for the XC5VLX110T-3FF1738C chip model is expected to grow in the future as more applications are developed for it. As the world continues to move towards a more connected and intelligent future, the need for reliable and powerful hardware solutions will only increase. The chip model is well-suited for use in networks and can be used for a variety of intelligent scenarios. It is also likely to be used in the era of fully intelligent systems, as it is capable of handling complex tasks with ease.
The XC5VLX110T-3FF1738C chip model is an ideal choice for those who need a reliable and powerful solution for digital signal processing, embedded processing, image processing, and other related tasks. Its high speed, low power consumption, scalability, and reliability make it an attractive choice for many industries. In the future, the demand for the chip model is expected to increase as more applications are developed for it, and it is likely to be used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||