
AMD Xilinx
XC5VLX110T-3FF1136C
XC5VLX110T-3FF1136C ECAD Model
XC5VLX110T-3FF1136C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 640 | |
Number of Outputs | 640 | |
Number of Logic Cells | 110592 | |
Number of CLBs | 8640 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 8640 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1136 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1136 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1136,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-1136 | |
Pin Count | 1136 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC5VLX110T-3FF1136C Datasheet Download
XC5VLX110T-3FF1136C Overview
The chip model XC5VLX110T-3FF1136C is a Field Programmable Gate Array (FPGA) from Xilinx. It is a powerful tool for digital system design, offering a wide range of applications from embedded systems to high-speed data processing. This chip model is designed with a range of features that make it suitable for a variety of applications. It has a high-speed transceiver, a high-speed clock management unit, and a high-performance memory interface.
The XC5VLX110T-3FF1136C chip model is designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. It is a low-cost, low-power, and easy-to-use FPGA, making it suitable for a wide range of applications. It is also designed with a range of features that make it suitable for a variety of applications. It has a high-speed transceiver, a high-speed clock management unit, and a high-performance memory interface.
The XC5VLX110T-3FF1136C chip model is designed to provide a reliable, high-performance, low-power, and cost-effective solution for a variety of applications. It is designed to provide a high-performance, low-power, and cost-effective solution for a variety of applications. It is also designed with a range of features that make it suitable for a variety of applications. It has a high-speed transceiver, a high-speed clock management unit, and a high-performance memory interface.
The chip model XC5VLX110T-3FF1136C is designed to provide a reliable, high-performance, low-power, and cost-effective solution for a variety of applications. It has a range of features that make it suitable for a variety of applications. These features include a high-speed transceiver, a high-speed clock management unit, and a high-performance memory interface. It is designed to provide a high-performance, low-power, and cost-effective solution for a variety of applications.
The industry trends of the chip model XC5VLX110T-3FF1136C and the future development of related industries are expected to be favorable. The chip model is designed to provide a reliable, high-performance, low-power, and cost-effective solution for a variety of applications. Its features make it suitable for a wide range of applications, from embedded systems to high-speed data processing. It is expected that the demand for this model will continue to grow as more applications are developed that require the use of this chip model.
Regarding the application environment, the XC5VLX110T-3FF1136C chip model is designed with the flexibility to be applied to advanced communication systems. It is designed with a range of features that make it suitable for a variety of applications. These features include a high-speed transceiver, a high-speed clock management unit, and a high-performance memory interface. It is also designed with the flexibility to be upgraded in the future. This chip model is expected to be able to meet the demands of future applications and the needs of advanced communication systems.
In conclusion, the chip model XC5VLX110T-3FF1136C is designed to provide a reliable, high-performance, low-power, and cost-effective solution for a variety of applications. Its features make it suitable for a wide range of applications, from embedded systems to high-speed data processing. It is expected that the demand for this model will continue to grow as more applications are developed that require the use of this chip model. It is also designed with the flexibility to be upgraded in the future and to be applied to advanced communication systems.
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3,497 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,921.0630 | $2,921.0630 |
10+ | $2,889.6538 | $28,896.5376 |
100+ | $2,732.6074 | $273,260.7360 |
1000+ | $2,575.5610 | $1,287,780.4800 |
10000+ | $2,355.6960 | $2,355,696.0000 |
The price is for reference only, please refer to the actual quotation! |