
AMD Xilinx
XC5VLX110T-1FFV1136I
XC5VLX110T-1FFV1136I ECAD Model
XC5VLX110T-1FFV1136I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 640 | |
Number of Outputs | 640 | |
Number of Logic Cells | 110592 | |
Number of CLBs | 8640 | |
Combinatorial Delay of a CLB-Max | 900 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 8640 CLBS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1136 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1136 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1136,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA-1136 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC5VLX110T-1FFV1136I Datasheet Download
XC5VLX110T-1FFV1136I Overview
The chip model XC5VLX110T-1FFV1136I is a modern integrated circuit designed for use in a range of industries, from communications to medical applications. This model is an advanced version of the XC5VLX110T family, which is known for its high performance and low power consumption. It is an ideal solution for a wide range of applications, from high-end networking to embedded systems.
The XC5VLX110T-1FFV1136I chip model offers a variety of advantages. It has a low power consumption, allowing for more efficient operation and longer battery life. It also has a high speed, allowing for faster data processing and communication. Additionally, the chip model is highly reliable, ensuring no unexpected failures or errors. It also has a small form factor, making it suitable for compact designs.
In terms of industry trends, the XC5VLX110T-1FFV1136I chip model is expected to be in high demand in the near future. Its low power consumption and high speed make it an ideal choice for a variety of applications, including data centers, embedded systems, and communications networks. Additionally, the chip model is expected to be used in a range of medical applications, such as medical imaging, medical diagnostics, and medical monitoring.
The XC5VLX110T-1FFV1136I chip model is designed for use in a range of applications. Its specific design requirements depend on the application environment and the technologies needed to support it. For instance, if the application environment requires high speed and low power consumption, the chip model should be designed to meet those requirements. Additionally, if the application environment requires the support of new technologies, such as artificial intelligence or machine learning, the chip model should be designed to support those technologies as well.
In order to ensure successful implementation of the XC5VLX110T-1FFV1136I chip model, it is important to understand its product description and design requirements. Additionally, actual case studies and precautions should be taken into consideration to ensure that the chip model functions properly and meets the needs of the application environment. By understanding the product description and design requirements, as well as taking into account actual case studies and precautions, the chip model can be successfully implemented in a range of applications.
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