
AMD Xilinx
XC5VLX110-3FFG1760C
XC5VLX110-3FFG1760C ECAD Model
XC5VLX110-3FFG1760C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 800 | |
Number of Outputs | 800 | |
Number of Logic Cells | 110592 | |
Number of CLBs | 8640 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 8640 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1760,42X42,40 | |
Pin Count | 1760 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC5VLX110-3FFG1760C Datasheet Download
XC5VLX110-3FFG1760C Overview
The Xilinx XC5VLX110-3FFG1760C chip model is a powerful and versatile device that was designed with a variety of applications in mind. It is a highly integrated FPGA (Field Programmable Gate Array) that can be used for a wide range of applications, including communications, data processing, and embedded systems.
The XC5VLX110-3FFG1760C was designed to be a highly reliable device that can be used in a variety of systems. It is capable of handling high-speed data transmission, and its low power consumption makes it an ideal choice for applications that require long-term, reliable operation. Furthermore, its advanced features, such as its high-speed transceivers and its large memory capacity, make it an ideal solution for advanced communication systems.
The XC5VLX110-3FFG1760C is also suitable for use in the era of fully intelligent systems. Its powerful processing capabilities and high-speed transceivers make it an ideal choice for applications such as artificial intelligence, machine learning, and autonomous systems. Furthermore, it can be used in networks to provide intelligent solutions and enable advanced communication scenarios.
The XC5VLX110-3FFG1760C is a highly configurable device and can be used for a variety of applications. Its design requirements include a wide range of features, such as high-speed transceivers, large memory capacity, and low power consumption. Furthermore, it can be used in a variety of systems, such as embedded systems, communications, and data processing.
To ensure the proper operation of the XC5VLX110-3FFG1760C, it is important to consider the specific design requirements of the device. This includes selecting the proper FPGA configuration, selecting the proper components, and ensuring that the design meets the required performance levels. Furthermore, it is important to consider the environmental conditions that the device will be exposed to, as this can have an effect on its performance and reliability.
In addition to the design requirements, it is also important to consider the actual case studies and the precautions that should be taken when using the XC5VLX110-3FFG1760C. This includes ensuring that the device is properly installed and configured, and that the necessary precautions are taken to ensure its proper operation. Furthermore, it is important to consider the environmental conditions that the device will be exposed to, as this can have an effect on its performance and reliability.
Overall, the Xilinx XC5VLX110-3FFG1760C is a powerful and versatile device that was designed with a variety of applications in mind. It is a highly integrated FPGA that can be used for a wide range of applications, including communications, data processing, and embedded systems. Furthermore, it is suitable for use in the era of fully intelligent systems and can be used in networks to provide intelligent solutions and enable advanced communication scenarios.
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2,440 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,422.3226 | $2,422.3226 |
10+ | $2,396.2762 | $23,962.7616 |
100+ | $2,266.0438 | $226,604.3760 |
1000+ | $2,135.8114 | $1,067,905.6800 |
10000+ | $1,953.4860 | $1,953,486.0000 |
The price is for reference only, please refer to the actual quotation! |