XC5VLX110-3FF676I
XC5VLX110-3FF676I
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rohs

AMD Xilinx

XC5VLX110-3FF676I


XC5VLX110-3FF676I
F20-XC5VLX110-3FF676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XC5VLX110-3FF676I ECAD Model


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XC5VLX110-3FF676I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 800
Number of Outputs 800
Number of Logic Cells 8640
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 710 MHz
Power Supplies 1,2.5 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC5VLX110-3FF676I Datasheet Download


XC5VLX110-3FF676I Overview



The Xilinx Virtex 5 FPGA XC5VLX110-3FF676I is a powerful, highly integrated chip model that is designed to meet the needs of a wide range of industries. It is the perfect choice for applications that require high performance, low power consumption, and scalability. The chip model is based on the Xilinx Virtex 5 FPGA family, which is one of the most advanced and reliable FPGA families available.


The XC5VLX110-3FF676I is a 676-pin, low-power, low-cost device with a wide range of features and capabilities. It includes 1056 user-configurable logic blocks, up to 1236 signal pins, and up to 8 DSP slices. This chip model also features a wide range of I/O options, including high-speed serial transceivers, LVDS, and PCI Express. Additionally, the chip model has built-in support for DDR2, DDR3, and QDRII SRAM memories.


The XC5VLX110-3FF676I is designed to meet the needs of a wide range of industries, including aerospace, automotive, consumer electronics, industrial automation, medical, and telecommunications. It is particularly well-suited for applications that require high performance, low power consumption, and scalability. The chip model is also ideal for applications that require a wide range of I/O options.


The XC5VLX110-3FF676I is expected to be in high demand in the future, as more industries are turning to FPGAs for their high-performance, low-power, and scalability needs. The chip model is also expected to be a popular choice for applications that require a wide range of I/O options. Additionally, the XC5VLX110-3FF676I is designed to meet the stringent requirements of the aerospace, automotive, and medical industries.


The product description and specific design requirements of the XC5VLX110-3FF676I are available in the Xilinx Virtex 5 FPGA data sheet. The data sheet provides detailed information about the chip model’s features and capabilities, as well as its system requirements. Additionally, the data sheet provides information about the chip model’s power consumption, signal pin count, and I/O options.


When it comes to the application environment, the XC5VLX110-3FF676I can support a wide range of technologies, including high-speed serial transceivers, LVDS, and PCI Express. Additionally, the chip model has built-in support for DDR2, DDR3, and QDRII SRAM memories. In order to ensure the best performance, it is important to consider the specific requirements of the application and select the appropriate technology.


Finally, it is important to note that when using the XC5VLX110-3FF676I, there are certain precautions that must be taken. For example, the chip model should be used in an environment that is free from static electricity and other sources of interference. Additionally, the chip model should be handled with care in order to avoid damage.


In conclusion, the Xilinx Virtex 5 FPGA XC5VLX110-3FF676I is a powerful, highly integrated chip model that is designed to meet the needs of a wide range of industries. It is expected to be in high demand in the future, due to its high performance, low power consumption, and scalability. Additionally, the chip model can support a wide range of technologies and has built-in support for DDR2, DDR3, and QDRII SRAM memories. It is important to consider the specific requirements of the application and select the appropriate technology, as well as to take certain precautions when handling the chip model.



5,580 In Stock


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Unit Price: $2,447.736
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,276.3945 $2,276.3945
10+ $2,251.9171 $22,519.1712
100+ $2,129.5303 $212,953.0320
1000+ $2,007.1435 $1,003,571.7600
10000+ $1,835.8020 $1,835,802.0000
The price is for reference only, please refer to the actual quotation!

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