
AMD Xilinx
XC5VLX110-3FF676I
XC5VLX110-3FF676I ECAD Model
XC5VLX110-3FF676I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Number of Inputs | 800 | |
Number of Outputs | 800 | |
Number of Logic Cells | 8640 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 710 MHz | |
Power Supplies | 1,2.5 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC5VLX110-3FF676I Datasheet Download
XC5VLX110-3FF676I Overview
The Xilinx Virtex 5 FPGA XC5VLX110-3FF676I is a powerful, highly integrated chip model that is designed to meet the needs of a wide range of industries. It is the perfect choice for applications that require high performance, low power consumption, and scalability. The chip model is based on the Xilinx Virtex 5 FPGA family, which is one of the most advanced and reliable FPGA families available.
The XC5VLX110-3FF676I is a 676-pin, low-power, low-cost device with a wide range of features and capabilities. It includes 1056 user-configurable logic blocks, up to 1236 signal pins, and up to 8 DSP slices. This chip model also features a wide range of I/O options, including high-speed serial transceivers, LVDS, and PCI Express. Additionally, the chip model has built-in support for DDR2, DDR3, and QDRII SRAM memories.
The XC5VLX110-3FF676I is designed to meet the needs of a wide range of industries, including aerospace, automotive, consumer electronics, industrial automation, medical, and telecommunications. It is particularly well-suited for applications that require high performance, low power consumption, and scalability. The chip model is also ideal for applications that require a wide range of I/O options.
The XC5VLX110-3FF676I is expected to be in high demand in the future, as more industries are turning to FPGAs for their high-performance, low-power, and scalability needs. The chip model is also expected to be a popular choice for applications that require a wide range of I/O options. Additionally, the XC5VLX110-3FF676I is designed to meet the stringent requirements of the aerospace, automotive, and medical industries.
The product description and specific design requirements of the XC5VLX110-3FF676I are available in the Xilinx Virtex 5 FPGA data sheet. The data sheet provides detailed information about the chip model’s features and capabilities, as well as its system requirements. Additionally, the data sheet provides information about the chip model’s power consumption, signal pin count, and I/O options.
When it comes to the application environment, the XC5VLX110-3FF676I can support a wide range of technologies, including high-speed serial transceivers, LVDS, and PCI Express. Additionally, the chip model has built-in support for DDR2, DDR3, and QDRII SRAM memories. In order to ensure the best performance, it is important to consider the specific requirements of the application and select the appropriate technology.
Finally, it is important to note that when using the XC5VLX110-3FF676I, there are certain precautions that must be taken. For example, the chip model should be used in an environment that is free from static electricity and other sources of interference. Additionally, the chip model should be handled with care in order to avoid damage.
In conclusion, the Xilinx Virtex 5 FPGA XC5VLX110-3FF676I is a powerful, highly integrated chip model that is designed to meet the needs of a wide range of industries. It is expected to be in high demand in the future, due to its high performance, low power consumption, and scalability. Additionally, the chip model can support a wide range of technologies and has built-in support for DDR2, DDR3, and QDRII SRAM memories. It is important to consider the specific requirements of the application and select the appropriate technology, as well as to take certain precautions when handling the chip model.
5,580 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,276.3945 | $2,276.3945 |
10+ | $2,251.9171 | $22,519.1712 |
100+ | $2,129.5303 | $212,953.0320 |
1000+ | $2,007.1435 | $1,003,571.7600 |
10000+ | $1,835.8020 | $1,835,802.0000 |
The price is for reference only, please refer to the actual quotation! |