XC5VLX110-3FF676C
XC5VLX110-3FF676C
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rohs

AMD Xilinx

XC5VLX110-3FF676C


XC5VLX110-3FF676C
F20-XC5VLX110-3FF676C
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA-676
BGA-676

XC5VLX110-3FF676C ECAD Model


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XC5VLX110-3FF676C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 440
Number of Outputs 440
Number of Logic Cells 110592
Number of CLBs 8640
Combinatorial Delay of a CLB-Max 670 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 8640 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Package Description BGA-676
Part Package Code BGA
Pin Count 676
ECCN Code 3A991.D

XC5VLX110-3FF676C Datasheet Download


XC5VLX110-3FF676C Overview



The XC5VLX110-3FF676C chip model is a high-performance model designed by Xilinx for digital signal processing, embedded processing, and image processing. It is a field-programmable gate array (FPGA) and is ideal for applications requiring high-speed data processing, such as those in the telecommunications, aerospace, and automotive industries. The chip model is designed to be programmed using the VHDL (VHSIC Hardware Description Language) and can be used to create custom digital logic circuits that are optimized for the specific application.


The XC5VLX110-3FF676C chip model offers several advantages over other FPGA models. It is capable of handling high-speed data processing with low power consumption, and its programmable logic blocks are highly configurable and can be used to create a wide variety of custom logic designs. Additionally, the chip model is relatively small and can be used in a variety of physical form factors, making it suitable for a variety of applications.


The XC5VLX110-3FF676C chip model is expected to be in high demand in the coming years due to its versatility and performance. As the demand for faster and more efficient data processing increases, the chip model is well-suited to meet these needs. Additionally, as the demand for embedded and image processing increases, the chip model is expected to be a popular choice for these applications due to its high performance and configurability.


The XC5VLX110-3FF676C chip model can be used to design custom logic circuits for a variety of applications. When designing with the chip model, specific design requirements must be considered. This includes the number of logic blocks needed, the type of logic operations to be performed, the speed of the logic, and the power requirements. Additionally, the chip model can be used in a variety of physical form factors, so the size of the board must also be taken into account.


Case studies of the XC5VLX110-3FF676C chip model have been conducted to demonstrate its capabilities. In one case study, the chip model was used to design a high-speed data processing circuit for a telecommunications application. The circuit was designed using the VHDL language and was able to process data at a rate of 10 Gbps with a power consumption of only 2.5 W.


When using the XC5VLX110-3FF676C chip model, there are a few precautions to consider. When designing with the chip model, the number of logic blocks and the type of logic operations must be carefully considered to ensure that the design meets the application's needs. Additionally, the power requirements of the chip must be taken into account to ensure that the design is power efficient. Lastly, the board size must be taken into account to ensure that the design fits into the desired physical form factor.


The XC5VLX110-3FF676C chip model is a powerful and versatile model suitable for a variety of applications. Its high-speed data processing capabilities and low power consumption make it well-suited for the telecommunications, aerospace, and automotive industries. Additionally, its configurable logic blocks and small size make it suitable for a variety of physical form factors. With its expected demand in the coming years, the chip model is sure to be a popular choice for embedded and image processing applications.



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Unit Price: $1,800.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,674.0000 $1,674.0000
10+ $1,656.0000 $16,560.0000
100+ $1,566.0000 $156,600.0000
1000+ $1,476.0000 $738,000.0000
10000+ $1,350.0000 $1,350,000.0000
The price is for reference only, please refer to the actual quotation!

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