AMD Xilinx
XC5VLX110-3FF1153I
XC5VLX110-3FF1153I ECAD Model
XC5VLX110-3FF1153I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 800 | |
| Number of Outputs | 800 | |
| Number of Logic Cells | 8640 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 710 MHz | |
| Power Supplies | 1,2.5 V | |
| JESD-30 Code | S-PBGA-B1153 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1153 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1153,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5VLX110-3FF1153I Datasheet Download
XC5VLX110-3FF1153I Overview
The XC5VLX110-3FF1153I chip model is a highly advanced and versatile multi-purpose device designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The chip model has a number of features that make it an attractive option for businesses and consumers alike.
The chip model is designed to provide high levels of performance and reliability. It is equipped with a high-speed processor, a large memory capacity, and a variety of I/O ports that allow it to be easily connected to a variety of devices. The chip model also features a wide range of advanced features that make it suitable for a variety of applications. These features include support for multiple operating systems, high-speed data transfer, and advanced power management.
The original design intention of the XC5VLX110-3FF1153I chip model was to provide businesses and consumers with a reliable and powerful device that could be used for a variety of applications. The chip model has been designed to be easily upgraded and can be used in advanced communication systems. This makes it an ideal choice for businesses and consumers who are looking for a reliable and powerful device that can handle a variety of tasks.
The chip model is expected to be in high demand in the future as businesses and consumers look for reliable and powerful solutions for their applications. The chip model's advanced features, such as its support for multiple operating systems, high-speed data transfer, and advanced power management, make it an attractive option for businesses and consumers alike. Its versatility and reliability make it an ideal choice for businesses and consumers who are looking for a reliable and powerful device that can handle a variety of tasks.
The XC5VLX110-3FF1153I chip model is a highly advanced and versatile device that can be used for a variety of applications. Its original design intention was to provide businesses and consumers with a reliable and powerful device that could be used for a variety of applications. The chip model has been designed to be easily upgraded and can be used in advanced communication systems. It is expected to be in high demand in the future as businesses and consumers look for reliable and powerful solutions for their applications. The chip model's advanced features, such as its support for multiple operating systems, high-speed data transfer, and advanced power management, make it an attractive option for businesses and consumers alike.
2,397 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||