
AMD Xilinx
XC5VLX110-2FFG1760I
XC5VLX110-2FFG1760I ECAD Model
XC5VLX110-2FFG1760I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 800 | |
Number of Outputs | 800 | |
Number of Logic Cells | 110592 | |
Number of CLBs | 8640 | |
Combinatorial Delay of a CLB-Max | 770 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 8640 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1760,42X42,40 | |
Pin Count | 1760 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC5VLX110-2FFG1760I Datasheet Download
XC5VLX110-2FFG1760I Overview
The XC5VLX110-2FFG1760I chip model is designed for high-performance digital signal processing, embedded processing, and image processing. It is a versatile chip that can be used in a variety of applications, from consumer electronics to industrial applications. It requires the use of HDL language, which is a hardware description language that allows the user to create and modify hardware designs.
The XC5VLX110-2FFG1760I chip model is a powerful and efficient solution for many tasks, and its use is becoming increasingly popular in a variety of industries. It offers many advantages over traditional solutions, such as lower power consumption, faster processing speeds, and improved reliability. As a result, the demand for this chip model is expected to increase in the future.
The XC5VLX110-2FFG1760I chip model is also expected to benefit from advances in technology. As new technologies are developed, the chip model will be able to take advantage of them to offer even more powerful and efficient solutions. For example, the chip model may be able to take advantage of artificial intelligence and machine learning algorithms to provide more accurate and efficient results.
In addition, the XC5VLX110-2FFG1760I chip model is expected to be in high demand in the future due to its versatility and ability to support a wide range of applications. As the demand for digital signal processing, embedded processing, and image processing increases, the XC5VLX110-2FFG1760I chip model will become an increasingly popular choice for many industries.
Overall, the XC5VLX110-2FFG1760I chip model is an excellent choice for many applications and is expected to be in high demand in the future. Its versatility, efficiency, and ability to support a wide range of applications make it an ideal solution for many industries. Furthermore, its ability to take advantage of new technologies and its expected demand in the future make it an even more attractive option.
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2,998 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,422.3226 | $2,422.3226 |
10+ | $2,396.2762 | $23,962.7616 |
100+ | $2,266.0438 | $226,604.3760 |
1000+ | $2,135.8114 | $1,067,905.6800 |
10000+ | $1,953.4860 | $1,953,486.0000 |
The price is for reference only, please refer to the actual quotation! |