AMD Xilinx
XC5VFX70T-3FFG665C
XC5VFX70T-3FFG665C ECAD Model
XC5VFX70T-3FFG665C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 71680 | |
| Number of CLBs | 5600 | |
| Combinatorial Delay of a CLB-Max | 670 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5600 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B665 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 665 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA665,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-665 | |
| Pin Count | 665 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC5VFX70T-3FFG665C Datasheet Download
XC5VFX70T-3FFG665C Overview
The Xilinx XC5VFX70T-3FFG665C chip model is a powerful FPGA that is ideal for a variety of applications. This model is particularly well-suited for high-performance digital signal processing, embedded processing, image processing, and other such tasks. It is designed to be used with the Hardware Description Language (HDL) for programming and development.
The XC5VFX70T-3FFG665C chip model has a wide range of features that make it ideal for a variety of projects. It has a large number of logic resources, including five-input Look-Up Tables (LUTs), memory blocks, and DSP slices. It also has a rich set of I/O ports, allowing for easy integration with external peripherals. This model also has excellent power efficiency, making it suitable for battery-powered applications.
When using the XC5VFX70T-3FFG665C chip model, it is important to consider the design requirements of the project. This includes the number of logic blocks, the type of memory used, the number of I/O ports, and the power requirements. It is also important to consider the development environment, including the programming language and the development tools.
The XC5VFX70T-3FFG665C chip model can be used to develop and popularize future intelligent robots. This model is powerful enough to handle the complex calculations and operations required for such robots. However, it is important to have the right technical talents in order to use the model effectively. These include software engineers with expertise in HDL programming and hardware engineers with knowledge of FPGA design.
In conclusion, the XC5VFX70T-3FFG665C chip model is a powerful FPGA that is well-suited for high-performance digital signal processing, embedded processing, image processing, and other such tasks. It is important to consider the design requirements of the project and the technical talents needed to use the model effectively. With the right resources, this model can be used to develop and popularize future intelligent robots.
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3,881 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,622.9616 | $1,622.9616 |
| 10+ | $1,605.5104 | $16,055.1040 |
| 100+ | $1,518.2544 | $151,825.4400 |
| 1000+ | $1,430.9984 | $715,499.2000 |
| 10000+ | $1,308.8400 | $1,308,840.0000 |
| The price is for reference only, please refer to the actual quotation! | ||