
AMD Xilinx
XC5VFX70T-3FFG1136C
XC5VFX70T-3FFG1136C ECAD Model
XC5VFX70T-3FFG1136C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 640 | |
Number of Outputs | 640 | |
Number of Logic Cells | 71680 | |
Number of CLBs | 5600 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5600 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1136 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1136 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1136,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-1136 | |
Pin Count | 1136 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC5VFX70T-3FFG1136C Datasheet Download
XC5VFX70T-3FFG1136C Overview
The Xilinx XC5VFX70T-3FFG1136C is a powerful and versatile FPGA chip that provides a wide range of features and capabilities. It is a high-end FPGA device that offers a variety of features such as high-speed transceivers, high-speed I/O, and powerful DSP blocks. It is the perfect choice for applications that require high performance, low power consumption, and flexibility.
The XC5VFX70T-3FFG1136C is designed for applications that require high-speed transceivers, high-speed I/O, and powerful DSP blocks. It is also designed for applications that require low power consumption and flexibility. This chip model is widely used in various industries such as aerospace, automotive, industrial, medical, and consumer electronics. It is also used in applications such as communications, industrial automation, data processing, and machine vision.
In terms of industry trends, the XC5VFX70T-3FFG1136C is expected to be widely used in the future due to its high performance, low power consumption, and flexibility. It is also expected to be used in a variety of applications due to its wide range of features and capabilities. It is also expected to be used in applications that require new technologies such as advanced machine learning, artificial intelligence, and 5G communication.
The XC5VFX70T-3FFG1136C has several advantages that make it an attractive choice for a variety of applications. It has a high-speed transceiver, which allows for fast data transfer rates. It also has a high-speed I/O, which allows for faster data processing. It also has powerful DSP blocks, which provide a wide range of features and capabilities. Additionally, it has low power consumption and flexibility, which makes it suitable for a variety of applications.
When designing with the XC5VFX70T-3FFG1136C, there are several factors to consider. It is important to understand the product description and design requirements of this chip model. Additionally, it is important to consider the application environment and whether or not the application requires the support of new technologies. It is also important to consider the actual case studies and precautions when designing with this chip model.
Overall, the Xilinx XC5VFX70T-3FFG1136C is a powerful and versatile FPGA chip that provides a wide range of features and capabilities. It is expected to be widely used in the future due to its high performance, low power consumption, and flexibility. It is also expected to be used in applications that require new technologies such as advanced machine learning, artificial intelligence, and 5G communication. When designing with this chip model, it is important to understand the product description and design requirements, consider the application environment and whether or not the application requires the support of new technologies, and consider the actual case studies and precautions.
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5,903 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,785.4512 | $1,785.4512 |
10+ | $1,766.2528 | $17,662.5280 |
100+ | $1,670.2608 | $167,026.0800 |
1000+ | $1,574.2688 | $787,134.4000 |
10000+ | $1,439.8800 | $1,439,880.0000 |
The price is for reference only, please refer to the actual quotation! |