XC5VFX70T-3FFG1136C
XC5VFX70T-3FFG1136C
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rohs

AMD Xilinx

XC5VFX70T-3FFG1136C


XC5VFX70T-3FFG1136C
F20-XC5VFX70T-3FFG1136C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-1136
BGA-1136

XC5VFX70T-3FFG1136C ECAD Model


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XC5VFX70T-3FFG1136C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 640
Number of Outputs 640
Number of Logic Cells 71680
Number of CLBs 5600
Combinatorial Delay of a CLB-Max 670 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 5600 CLBS
Power Supplies 1,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1136
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1136
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1136,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.25 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-1136
Pin Count 1136
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC5VFX70T-3FFG1136C Datasheet Download


XC5VFX70T-3FFG1136C Overview



The Xilinx XC5VFX70T-3FFG1136C is a powerful and versatile FPGA chip that provides a wide range of features and capabilities. It is a high-end FPGA device that offers a variety of features such as high-speed transceivers, high-speed I/O, and powerful DSP blocks. It is the perfect choice for applications that require high performance, low power consumption, and flexibility.


The XC5VFX70T-3FFG1136C is designed for applications that require high-speed transceivers, high-speed I/O, and powerful DSP blocks. It is also designed for applications that require low power consumption and flexibility. This chip model is widely used in various industries such as aerospace, automotive, industrial, medical, and consumer electronics. It is also used in applications such as communications, industrial automation, data processing, and machine vision.


In terms of industry trends, the XC5VFX70T-3FFG1136C is expected to be widely used in the future due to its high performance, low power consumption, and flexibility. It is also expected to be used in a variety of applications due to its wide range of features and capabilities. It is also expected to be used in applications that require new technologies such as advanced machine learning, artificial intelligence, and 5G communication.


The XC5VFX70T-3FFG1136C has several advantages that make it an attractive choice for a variety of applications. It has a high-speed transceiver, which allows for fast data transfer rates. It also has a high-speed I/O, which allows for faster data processing. It also has powerful DSP blocks, which provide a wide range of features and capabilities. Additionally, it has low power consumption and flexibility, which makes it suitable for a variety of applications.


When designing with the XC5VFX70T-3FFG1136C, there are several factors to consider. It is important to understand the product description and design requirements of this chip model. Additionally, it is important to consider the application environment and whether or not the application requires the support of new technologies. It is also important to consider the actual case studies and precautions when designing with this chip model.


Overall, the Xilinx XC5VFX70T-3FFG1136C is a powerful and versatile FPGA chip that provides a wide range of features and capabilities. It is expected to be widely used in the future due to its high performance, low power consumption, and flexibility. It is also expected to be used in applications that require new technologies such as advanced machine learning, artificial intelligence, and 5G communication. When designing with this chip model, it is important to understand the product description and design requirements, consider the application environment and whether or not the application requires the support of new technologies, and consider the actual case studies and precautions.



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Unit Price: $1,919.84
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,785.4512 $1,785.4512
10+ $1,766.2528 $17,662.5280
100+ $1,670.2608 $167,026.0800
1000+ $1,574.2688 $787,134.4000
10000+ $1,439.8800 $1,439,880.0000
The price is for reference only, please refer to the actual quotation!

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