
AMD Xilinx
XC5VFX70T-3FF665C
XC5VFX70T-3FF665C ECAD Model
XC5VFX70T-3FF665C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 71680 | |
Number of CLBs | 5600 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5600 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B665 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 665 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA665,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.9 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-665 | |
Pin Count | 665 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC5VFX70T-3FF665C Datasheet Download
XC5VFX70T-3FF665C Overview
The Xilinx XC5VFX70T-3FF665C chip model is a powerful and efficient FPGA device that can be used in a variety of high-performance applications. It is suitable for digital signal processing, embedded processing, image processing, and other tasks that require the use of HDL language. This chip model is the latest addition to the Xilinx family of FPGAs and offers many advantages over its predecessors.
The XC5VFX70T-3FF665C chip model is a high-performance FPGA that offers a wide range of features and benefits. It has a large capacity of up to 70 million logic cells, which is more than double the capacity of the previous version. It also has a high-speed clock frequency of up to 500 MHz, which is higher than any other FPGA on the market. Additionally, the chip model has a low power consumption, making it ideal for applications that require long battery life.
The XC5VFX70T-3FF665C chip model has a wide range of features and benefits that make it suitable for a variety of applications. It has a high-speed clock frequency of up to 500 MHz, which is higher than any other FPGA on the market. Additionally, the chip model has a large capacity of up to 70 million logic cells, which is more than double the capacity of the previous version. It also has a low power consumption, making it ideal for applications that require long battery life.
The product description and specific design requirements of the XC5VFX70T-3FF665C chip model depend on the application. For example, for digital signal processing applications, it can be used to process a wide range of signals, including audio, video, and data signals. For embedded processing applications, the chip model can be used to create a wide range of applications such as medical devices, industrial automation systems, and robotics. For image processing applications, the chip model can be used to create high-resolution images with minimal power consumption.
The XC5VFX70T-3FF665C chip model is expected to be in high demand in the future, as it is an ideal device for a variety of applications. Its high performance, low power consumption, and large capacity make it ideal for a wide range of applications. Additionally, the chip model is easy to use and requires minimal design effort, making it an attractive option for developers.
In order to ensure that the XC5VFX70T-3FF665C chip model is used correctly, it is important to understand the product description and design requirements. Additionally, it is important to consider actual case studies and precautions when using the chip model. For example, it is important to consider the power consumption of the chip model, as it can cause problems if it is not managed correctly. Additionally, it is important to ensure that the chip model is used in accordance with the HDL language and that the design is optimized for the chip model. By following these guidelines, the XC5VFX70T-3FF665C chip model can be used to its full potential and provide a powerful and efficient solution for a variety of applications.
You May Also Be Interested In
5,427 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,622.9616 | $1,622.9616 |
10+ | $1,605.5104 | $16,055.1040 |
100+ | $1,518.2544 | $151,825.4400 |
1000+ | $1,430.9984 | $715,499.2000 |
10000+ | $1,308.8400 | $1,308,840.0000 |
The price is for reference only, please refer to the actual quotation! |