
AMD Xilinx
XC5VFX130T-3FF1738C
XC5VFX130T-3FF1738C ECAD Model
XC5VFX130T-3FF1738C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 840 | |
Number of Outputs | 840 | |
Number of Logic Cells | 13172 | |
Number of CLBs | 10240 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 10240 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1738 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1738 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1738,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-1738 | |
Pin Count | 1738 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC5VFX130T-3FF1738C Datasheet Download
XC5VFX130T-3FF1738C Overview
The Xilinx Virtex 5 FPGA chip model XC5VFX130T-3FF1738C is a device that is capable of providing a wide range of features, allowing for the implementation of a variety of applications. This chip model is designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. It is a versatile device that is capable of providing a wide range of features, allowing for the implementation of a variety of applications.
The Xilinx Virtex 5 FPGA chip model XC5VFX130T-3FF1738C is an ideal choice for a wide range of applications, including industrial automation, medical, aerospace, automotive, communications, and consumer electronics. This chip model is designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. It is a versatile device that is capable of providing a wide range of features, allowing for the implementation of a variety of applications.
The advantages of the Xilinx Virtex 5 FPGA chip model XC5VFX130T-3FF1738C include its high-performance, low-power, and cost-effective solutions. This chip model is designed to provide a wide range of features, allowing for the implementation of a variety of applications. It is also capable of providing high-speed data transfer, allowing for the rapid transfer of data between different components. Additionally, this chip model is designed to be highly reliable and durable, ensuring that it can withstand a variety of conditions and environments.
The demand for the Xilinx Virtex 5 FPGA chip model XC5VFX130T-3FF1738C is expected to continue to grow as more industries begin to utilize the chip model. This chip model is designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. Additionally, this chip model is capable of providing high-speed data transfer, allowing for the rapid transfer of data between different components.
The original design intention of the Xilinx Virtex 5 FPGA chip model XC5VFX130T-3FF1738C was to provide high-performance, low-power, and cost-effective solutions for a variety of applications. This chip model is designed to be highly reliable and durable, ensuring that it can withstand a variety of conditions and environments. Additionally, this chip model is capable of providing high-speed data transfer, allowing for the rapid transfer of data between different components. The chip model is also capable of being upgraded in the future, allowing for the implementation of more advanced applications and features.
The Xilinx Virtex 5 FPGA chip model XC5VFX130T-3FF1738C can be applied to the development and popularization of future intelligent robots. This chip model is designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. Additionally, this chip model is capable of providing high-speed data transfer, allowing for the rapid transfer of data between different components. In order to use the chip model effectively, technical knowledge of robotics, programming, and electronics is required. Additionally, knowledge of the chip model is required in order to properly configure and utilize the chip model.
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2,023 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,185.9850 | $5,185.9850 |
10+ | $5,130.2218 | $51,302.2176 |
100+ | $4,851.4054 | $485,140.5360 |
1000+ | $4,572.5890 | $2,286,294.4800 |
10000+ | $4,182.2460 | $4,182,246.0000 |
The price is for reference only, please refer to the actual quotation! |