
AMD Xilinx
XC5VFX100T-3FFG1136C
XC5VFX100T-3FFG1136C ECAD Model
XC5VFX100T-3FFG1136C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 640 | |
Number of Outputs | 640 | |
Number of Logic Cells | 102400 | |
Number of CLBs | 8000 | |
Combinatorial Delay of a CLB-Max | 670 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8000 CLBS | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1136 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1136 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1136,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-1136 | |
Pin Count | 1136 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC5VFX100T-3FFG1136C Datasheet Download
XC5VFX100T-3FFG1136C Overview
The Xilinx XC5VFX100T-3FFG1136C chip model is a high-performance FPGA. It is designed to provide a cost-effective solution for high-performance applications. This chip model is a member of the Virtex-5 family, featuring the highest performance and highest density of the Virtex-5 range. It is ideal for applications that require high-speed, low-power, and high-density FPGA solutions.
The XC5VFX100T-3FFG1136C chip model is equipped with 1,136 user-configurable logic blocks and a maximum of 1,024 I/O pins. It also features two PowerPC 440 processors and two high-speed transceivers. This chip model has an array of features that make it an ideal choice for applications that require high-performance, low-power, and high-density FPGA solutions.
The XC5VFX100T-3FFG1136C chip model is ideal for a variety of applications, including high-speed networking, high-performance computing, and embedded systems. It is also suitable for a wide range of consumer applications, such as digital cameras, cell phones, and other consumer electronics. The chip model is also suitable for industrial applications, such as machine vision, medical imaging, and industrial control systems.
The Xilinx XC5VFX100T-3FFG1136C chip model provides a number of advantages, including high performance, low power consumption, and high density. The chip model also features a wide range of features, such as support for multiple clock domains, multiple clock frequencies, and multiple I/O standards. The chip model also features a wide range of I/O options, including LVDS, SSTL, LVCMOS, and HSTL.
The XC5VFX100T-3FFG1136C chip model is expected to experience a high demand in the future, due to its cost-effectiveness, high performance, and low power consumption. The chip model is also expected to be widely used in a variety of applications, such as networking, high-performance computing, and embedded systems.
The design requirements for the XC5VFX100T-3FFG1136C chip model include a comprehensive understanding of FPGA design, including coding, simulation, and verification. Designers should also consider the performance, power consumption, and cost requirements of the application. In addition, designers should be aware of the various I/O standards supported by the chip model, as well as the various clock frequencies and clock domains supported by the chip model.
Case studies of the XC5VFX100T-3FFG1136C chip model can provide valuable insights into the design and implementation of the chip model. Such case studies can also provide valuable information on the performance, power consumption, and cost of the chip model. In addition, case studies can provide valuable information on the various I/O standards and clock domains supported by the chip model.
When designing applications with the XC5VFX100T-3FFG1136C chip model, it is important to consider the performance, power consumption, and cost requirements of the application. In addition, designers should be aware of the various I/O standards and clock frequencies supported by the chip model. It is also important to consider the potential future requirements of the application, as new technologies may be required to support the application in the future.
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3,510 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,398.7557 | $3,398.7557 |
10+ | $3,362.2099 | $33,622.0992 |
100+ | $3,179.4811 | $317,948.1120 |
1000+ | $2,996.7523 | $1,498,376.1600 |
10000+ | $2,740.9320 | $2,740,932.0000 |
The price is for reference only, please refer to the actual quotation! |