AMD Xilinx
XC5215-6PG299C
XC5215-6PG299C ECAD Model
XC5215-6PG299C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 244 | |
| Number of Outputs | 244 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P299 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 299 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA299,20X20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 52.324 mm | |
| Length | 52.324 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA299,20X20 | |
| Pin Count | 299 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5215-6PG299C Datasheet Download
XC5215-6PG299C Overview
The XC5215-6PG299C chip model is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a versatile chip that can be used for a variety of applications, and it requires the use of HDL language. This chip model is an advanced model that is designed to meet the needs of today’s ever-changing technological landscape.
Regarding the industry trends of the chip model XC5215-6PG299C and the future development of related industries, it is necessary to consider what specific technologies are needed. The XC5215-6PG299C chip model is capable of supporting the latest technological advancements, such as 5G networks, artificial intelligence, and machine learning. It is important to consider how these technologies can be implemented in order to maximize the potential of the chip model.
The XC5215-6PG299C chip model is also capable of being used in networks and in intelligent scenarios. It is possible to apply the chip model to fully intelligent systems, such as autonomous vehicles, smart homes, and robotic systems. In addition, the chip model can be used in industrial applications, such as factory automation, as well as in medical applications, such as medical imaging.
The XC5215-6PG299C chip model is a powerful and versatile chip model that is capable of supporting the latest technological advancements. It is an ideal choice for a variety of applications, and it is capable of being used in networks, intelligent scenarios, and fully intelligent systems. It is important to consider the specific technologies that are needed in order to maximize the potential of the chip model and to ensure that it is capable of meeting the needs of the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||