AMD Xilinx
XC5215-6BG352C
XC5215-6BG352C ECAD Model
XC5215-6BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 244 | |
| Number of Outputs | 244 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5215-6BG352C Datasheet Download
XC5215-6BG352C Overview
The XC5215-6BG352C chip model is a highly integrated and powerful integrated circuit, developed by Xilinx for use in advanced communication systems. The chip model is designed to provide the best possible performance and flexibility, allowing users to customize their system to meet their specific requirements. With its high-performance capabilities, the XC5215-6BG352C chip model is ideal for applications such as wireless communication, high-speed data transmission, and video processing.
The XC5215-6BG352C chip model is designed with a number of features that make it an ideal choice for advanced communication systems. It is designed to support a wide range of protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. The chip model also supports multiple frequency bands, allowing for the transmission of data over multiple frequencies. Additionally, the chip model supports a wide range of communication protocols, including IP, VoIP, and SIP.
In addition to the features mentioned above, the XC5215-6BG352C chip model also has the capability to be upgraded in the future. This allows users to upgrade their system to meet their changing needs and to take advantage of the latest technological advancements. The chip model also has the ability to be used in the development and popularization of future intelligent robots.
When using the XC5215-6BG352C chip model, there are a few precautions that users should take. First, the chip model should be handled with care and should not be exposed to extreme temperatures or humidity. Additionally, users should ensure that the chip model is properly connected to the power source and that all connections are secure. Finally, users should also be aware of the power requirements of the chip model and ensure that the system is properly configured to meet these requirements.
To use the XC5215-6BG352C chip model effectively, users should have a strong understanding of the various communication protocols and frequency bands that the chip model supports. Additionally, users should have a good understanding of the power requirements of the chip model and be familiar with the various configuration options available. Finally, users should also have a strong knowledge of the various programming languages, such as C and C++, that are used to program the chip model.
In conclusion, the XC5215-6BG352C chip model is an ideal choice for advanced communication systems. With its high-performance capabilities and the ability to be upgraded in the future, the chip model is an excellent choice for users who are looking to customize their system to meet their specific requirements. Additionally, the chip model has the potential to be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, users should have a strong understanding of the various communication protocols and frequency bands that the chip model supports, as well as a good understanding of the power requirements and configuration options available.
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