XC5215-6BG225C
XC5215-6BG225C
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rohs

AMD Xilinx

XC5215-6BG225C


XC5215-6BG225C
F20-XC5215-6BG225C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-225
PLASTIC, BGA-225

XC5215-6BG225C ECAD Model


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XC5215-6BG225C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 244
Number of Outputs 244
Number of Logic Cells 484
Number of Equivalent Gates 15000
Number of CLBs 484
Combinatorial Delay of a CLB-Max 5.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 484 CLBS, 15000 GATES
Additional Feature MAX AVAILABLE 23000 LOGIC GATES
Clock Frequency-Max 83 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-225
Pin Count 225
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC5215-6BG225C Datasheet Download


XC5215-6BG225C Overview



The chip model XC5215-6BG225C has been a major player in the chip industry since its launch in the early 2000s. It has been widely used in a variety of applications, ranging from consumer electronics to industrial automation. With its advanced features and high performance, it has become a popular choice for many manufacturers and developers.


The chip model XC5215-6BG225C is based on a highly advanced technology platform, with a number of features that make it suitable for a wide range of applications. The chip has a high speed processor, a high-performance memory controller, and a wide range of communication interfaces. It is also capable of supporting multiple operating systems, such as Windows, Linux, and Android.


The industry trends of the chip model XC5215-6BG225C are constantly evolving, and it is likely that the chip will continue to be used in a variety of applications in the future. As new technologies become available, the chip model XC5215-6BG225C may be upgraded to take advantage of them. For example, the chip may be upgraded to support new communication protocols or to take advantage of new hardware features.


In addition to its current applications, the chip model XC5215-6BG225C has the potential to be used in a variety of new and advanced communication systems. It is likely that the chip will be used in the future in a variety of intelligent scenarios, such as self-driving cars and automated homes. The chip is capable of supporting a wide range of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee, which makes it ideal for these types of applications.


The chip model XC5215-6BG225C is also well suited for use in the era of fully intelligent systems. It has the potential to be used in a variety of networks, such as the Internet of Things (IoT), where it can be used to connect different devices and systems. The chip is also capable of supporting a variety of intelligent applications, such as facial recognition and voice recognition.


The chip model XC5215-6BG225C is a highly advanced technology platform that has the potential to be used in a variety of applications in the future. It has the potential to be upgraded to take advantage of new technologies and be used in a variety of advanced communication systems and intelligent scenarios. As the industry continues to evolve, it is likely that the chip model XC5215-6BG225C will continue to be a major player in the chip industry.



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