AMD Xilinx
XC5215-4HQG208C
XC5215-4HQG208C ECAD Model
XC5215-4HQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3.8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HFQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5215-4HQG208C Datasheet Download
XC5215-4HQG208C Overview
The XC5215-4HQG208C chip model is a powerful, cost-effective solution for a variety of communications and networking applications. It was designed to provide high-speed data transfer and reliable performance for a range of applications, such as wireless access points, routers, and switches. The chip model offers an impressive range of features, including a high-performance processor, high-speed memory, and a wide range of peripherals.
The XC5215-4HQG208C chip model is expected to be in high demand in the future, particularly in the rapidly growing field of wireless communications. The chip model has been designed to meet the needs of next-generation wireless networks and can be used to support a variety of services, including voice and data. The chip model also offers enhanced security features, which make it ideal for use in secure networks.
The XC5215-4HQG208C chip model is also designed to be easily upgradable, allowing users to take advantage of the latest advances in technology. This makes it an ideal choice for those who want to keep up with the latest developments in the industry. In addition, the chip model is also capable of supporting advanced communication systems, such as LTE and 5G networks. This makes it a great choice for those who need to stay ahead of the competition.
The XC5215-4HQG208C chip model is also suitable for use in a variety of networks and intelligent scenarios. It can be used to power a variety of devices, including routers, switches, and access points. The chip model also supports a wide range of protocols, such as IPv4 and IPv6, making it suitable for use in a variety of networks. In addition, the chip model is also capable of supporting advanced technologies, such as machine learning and artificial intelligence, making it suitable for use in the era of fully intelligent systems.
The XC5215-4HQG208C chip model is a powerful, cost-effective solution for a variety of communications and networking applications. With its impressive range of features and upgradability, it is expected to be in high demand in the future. It is also capable of supporting advanced communication systems, networks, and intelligent scenarios, making it suitable for use in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||