AMD Xilinx
XC5215-4HQ208C
XC5215-4HQ208C ECAD Model
XC5215-4HQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 244 | |
| Number of Outputs | 244 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3.8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5215-4HQ208C Datasheet Download
XC5215-4HQ208C Overview
The chip model XC5215-4HQ208C is a highly advanced semiconductor device developed by a leading manufacturer. It is designed to provide a reliable, high-performance solution for a wide range of applications. This model is ideal for use in communication systems, networks, and other intelligent scenarios.
The XC5215-4HQ208C offers a number of advantages over other chip models. It is designed to be highly efficient and cost-effective. It also has a high level of integration, meaning that it can be used in a variety of applications without requiring additional components. Additionally, its low power consumption makes it an ideal choice for applications that require long battery life.
The XC5215-4HQ208C is expected to see increasing demand in the coming years, as more industries look to take advantage of its benefits. For example, it can be used in communication systems, allowing for faster transmission of data and improved reliability. Additionally, it can be used in networks to improve performance and reduce latency. Finally, it can also be used in intelligent scenarios, such as autonomous vehicles, as it is capable of performing complex tasks.
The XC5215-4HQ208C is designed to be easily upgradable, allowing for future improvements and updates. This means that it can be used in the current and future generations of communication systems and networks. Additionally, it is capable of being used in the era of fully intelligent systems, as it is capable of performing complex tasks and responding to changing conditions.
Overall, the XC5215-4HQ208C is a highly advanced chip model that offers a number of advantages. It is designed to be highly efficient and cost-effective, and its upgradability means that it can be used in the current and future generations of communication systems and networks. Additionally, it can be used in intelligent scenarios, such as autonomous vehicles, and is capable of performing complex tasks. As such, it is expected to see increasing demand in the coming years, as more industries look to take advantage of its benefits.
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