AMD Xilinx
XC5215-4BG352C
XC5215-4BG352C ECAD Model
XC5215-4BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 244 | |
| Number of Outputs | 244 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3.8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5215-4BG352C Datasheet Download
XC5215-4BG352C Overview
The chip model XC5215-4BG352C is a powerful and versatile integrated circuit designed for a wide range of applications. It is a 32-bit RISC processor with a built-in memory controller, a high-performance DMA controller, and a wide range of peripheral interfaces. It is capable of running operating systems such as Linux, Windows, and Android. The processor has a low power consumption and can be used in a variety of applications including embedded systems, automotive, industrial, and consumer electronics.
The chip model XC5215-4BG352C has several advantages over other chips. It has a high processing power, low power consumption, and a wide range of peripheral support. It is also capable of running multiple operating systems and can be used in various applications. This makes it an ideal choice for many industries.
The demand for the chip model XC5215-4BG352C is expected to grow in the future as the need for more powerful and efficient chips increases. It is likely to be used in many industries, such as automotive, industrial, and consumer electronics. It is also likely to be used in advanced communication systems, such as 5G networks, as well as in the era of fully intelligent systems.
The chip model XC5215-4BG352C was designed with the intention of being able to be used in a wide range of applications. It is highly upgradeable, allowing for future upgrades and improvements. This makes it a great choice for those looking to use the chip in the future. It is also possible to use the chip in networks, as well as in intelligent scenarios. This makes it a great choice for those looking to use the chip in the future.
The chip model XC5215-4BG352C has a wide range of applications, making it a great choice for many industries. It is highly upgradeable, allowing for future upgrades and improvements. It is also possible to use the chip in networks, as well as in intelligent scenarios. This makes it a great choice for those looking to use the chip in the future. With its powerful processing power, low power consumption, and wide range of peripheral support, the chip model XC5215-4BG352C is a great choice for many industries.
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|---|---|---|
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