
AMD Xilinx
XC5215-3PQ160C
XC5215-3PQ160C ECAD Model
XC5215-3PQ160C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 244 | |
Number of Outputs | 244 | |
Number of Logic Cells | 484 | |
Number of Equivalent Gates | 15000 | |
Number of CLBs | 484 | |
Combinatorial Delay of a CLB-Max | 3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 484 CLBS, 15000 GATES | |
Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
Clock Frequency-Max | 83 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP160,1.2SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | PLASTIC, QFP-160 | |
Pin Count | 160 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC5215-3PQ160C Datasheet Download
XC5215-3PQ160C Overview
The XC5215-3PQ160C chip model is a product of the advanced semiconductor industry, which is designed for high-performance network applications. As a powerful chip model, it has a wide range of potential applications in the future, especially in intelligent scenarios.
The XC5215-3PQ160C chip model has a powerful 32-bit RISC processor, which can be used to easily implement various intelligent algorithms. It is also equipped with a variety of peripheral interfaces and advanced communication protocols, which can be used to develop a variety of network applications. In addition, it is equipped with a variety of advanced technologies, such as a low-power design, a high-speed data transfer, and a high-speed memory interface, which can be used to improve the performance and reliability of the chip model.
In the era of fully intelligent systems, the XC5215-3PQ160C chip model can be used for a variety of applications, such as intelligent robots, intelligent home appliances, and autonomous vehicles. In addition, it can also be used to develop a variety of intelligent systems, such as intelligent medical systems, intelligent transportation systems, and intelligent manufacturing systems.
In order to effectively use the XC5215-3PQ160C chip model, it is necessary to have a certain understanding of the product description and design requirements of the chip model. In addition, it is also necessary to have a certain understanding of the actual case studies and precautions of the chip model. In addition, it is necessary to have a certain understanding of the relevant technologies, such as embedded systems, artificial intelligence, and network communication.
In conclusion, the XC5215-3PQ160C chip model is a powerful chip model with a wide range of potential applications in the future, especially in intelligent scenarios. It can be used to develop a variety of intelligent systems and applications, such as intelligent robots and autonomous vehicles. In order to effectively use the chip model, it is necessary to have a certain understanding of the product description and design requirements of the chip model, as well as the relevant technologies.
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