AMD Xilinx
XC5215-3HQG240C
XC5215-3HQG240C ECAD Model
XC5215-3HQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HFQFP, | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5215-3HQG240C Datasheet Download
XC5215-3HQG240C Overview
The chip model XC5215-3HQG240C is a high-performance, low-cost chip developed by Xilinx Corporation, a leading provider of programmable logic solutions. This model is designed to provide users with a wide range of features, including high-speed data processing, low power consumption, and high reliability. It is mainly used in communication systems, industrial control systems, and other embedded systems.
The XC5215-3HQG240C chip model has several advantages that make it an attractive choice for many applications. It is designed with a high-speed, low-power architecture that can support up to 3.2GHz of clock speed. It also features a wide range of peripheral interfaces, such as USB, Ethernet, and HDMI, that can be used to connect to a variety of devices. In addition, the chip has a high level of integration, allowing it to support multiple functions in a single package.
In terms of future trends, the demand for the XC5215-3HQG240C chip model is expected to remain strong in the coming years. This is due to the increasing demand for high-performance, low-cost solutions in the communications and industrial control industries. As the chip is already highly integrated, it can be used in a variety of applications, including advanced communication systems.
The original design intention of the XC5215-3HQG240C chip model was to provide users with a low-cost, high-performance solution. As such, the chip is designed to be highly reliable and efficient, and it is expected to be able to support future upgrades. This means that the chip can be used in more advanced communication systems, such as 5G networks, without the need for additional hardware.
In conclusion, the XC5215-3HQG240C chip model is an attractive option for many applications due to its high-performance, low-cost design. The chip is expected to remain in high demand in the coming years, and its high level of integration makes it a viable solution for advanced communication systems. Furthermore, its design allows for future upgrades, making it a great choice for those looking for a reliable and efficient solution.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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