AMD Xilinx
XC5215-3HQG208C
XC5215-3HQG208C ECAD Model
XC5215-3HQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HFQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5215-3HQG208C Datasheet Download
XC5215-3HQG208C Overview
The chip model XC5215-3HQG208C is a cutting-edge semiconductor technology that has been developed to meet the needs of the ever-evolving tech industry. This chip model is designed to be used in a variety of different networks and intelligent scenarios, making it an ideal choice for businesses and other organizations looking to stay competitive in the modern world.
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In terms of actual case studies and precautions, it is important to note that the chip model XC5215-3HQG208C is designed to provide the highest level of performance and reliability while also being able to keep up with the ever-changing demands of the tech industry. It is important to keep in mind that the chip model is designed to be used in a variety of different applications, such as networking, intelligent scenarios, and fully intelligent systems. Therefore, it is important to ensure that the chip model is designed with the correct specifications for the particular application that it is being used for.
Overall, the chip model XC5215-3HQG208C is a cutting-edge semiconductor technology that has been developed to meet the needs of the ever-evolving tech industry. It is designed to provide the highest level of performance and reliability while also being able to keep up with the ever-changing demands of the tech industry. Additionally, it is important to ensure that the chip model is designed with the correct specifications for the particular application that it is being used for. With this in mind, it is clear that the chip model XC5215-3HQG208C is an ideal choice for businesses and other organizations looking to stay competitive in the modern world.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||